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A kind of high modulus low temperature damping silicone resin composition and preparation method thereof

A silicone resin composition, high modulus technology, applied in the field of high modulus low temperature damping silicone resin composition and its preparation, can solve the problems of low hardness, low compression modulus, etc., achieve internal uniformity, excellent mechanical strength, good looking effect

Active Publication Date: 2015-11-04
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In Document 2 (Synthetic Rubber Industry, 2007, 30(2):158), methyl vinyl silicone rubber / butyl rubber (PMVS / IIR) was prepared using phenolic resin as a crosslinking agent by mixing-molding process. Composite materials, although their damping temperature range is wider, their hardness is lower (only 28), and their compressive modulus is lower than 5MPa

Method used

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  • A kind of high modulus low temperature damping silicone resin composition and preparation method thereof

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preparation example Construction

[0059] The preparation method of high modulus silicone resin composition of the present invention comprises the following steps:

[0060] a. Mixing of organopolysiloxane, silica powder and dispersant

[0061] The organopolysiloxane with a viscosity-average degree of polymerization of 5,000 or more and a specific surface area (BET method) of not less than 50m 2 / g of silica powder reinforcing agent, silica dispersant and weak reinforcing fillers such as Baiyanhua, diatomaceous earth, etc., are mixed together by using a rubber mixer, internal mixer or kneader, and then by using The obtained mixture is heat-treated by means of a kneader or a dryer, or vacuumized at a high temperature in a kneader to discharge small molecules, thereby obtaining an organopolysiloxane reinforcing base material. The purpose of heat treatment is to remove volatile components and accelerate the reaction between silica powder and dispersant. The heat treatment temperature is not specifically limited. ...

Embodiment 1

[0076]Component A: 100 parts contains 99.825mol% dimethylsiloxane units, 0.15mol% methylvinylsiloxane units and 0.025mol% dimethylvinylsiloxy groups, and has an average polymerization rate of about 8000 Organopolysiloxane with high density, component B: 40 parts BET specific surface area is 195m 2 Dry silica (ingredient B) AS-200 (trade name, manufactured by Shenyang Chemical Co., Ltd.) per g, and silica dispersant: 5 parts contain silanol groups at both ends, and have a viscosity of 29 mm 2 / s (23° C.) dimethyl polysiloxane was added to a kneader, and heated and kneaded at 180° C. for 2 hours to obtain a polysiloxane material.

[0077] To 140 parts of the polysiloxane base thus prepared was added:

[0078] Ingredient C: 40 parts of magnesium methacrylate (particle size less than 5 microns, purity 88%);

[0079] Component E: 0.8 parts of 2,5-dimethyl-2,5-di-tert-butylperoxyhexane (purity 95%) as a curing agent;

[0080] 3 parts of ferric oxide (purity 98%) as a heat-resista...

Embodiment 2

[0085] Component A: Contains 90.825 mol% of dimethylsiloxane units, 0.15mol% of methylvinylsiloxane units, 10.0mol% of methylphenylsiloxane units, and dimethylvinylsiloxane units per 100 parts 0.025 mole % organopolysiloxane with an average degree of polymerization of 8000, component B: 50 parts BET surface area 200 m 2 / g of fumed silica AS-200, silica dispersant: 5 parts having silanol groups at both ends and a viscosity of 29mm 2 / s (23°C) dimethyl polysiloxane is compounded with a kneader, and then heat-treated at 180°C for 2 hours to make a polysiloxane material.

[0086] To 150 parts of the polysiloxane base thus prepared was added:

[0087] Ingredient C: 60 parts of zinc methacrylate (particle size less than 5 microns, purity 88%);

[0088] Component E: 1.0 parts of dicumyl peroxide (purity 95%) as curing agent;

[0089] 3 parts of cerium oxide (purity 98%) as a heat-resistant additive;

[0090] Component D: 80 parts of isobutylene-isoprene copolymer (Polysar 301, M...

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Abstract

The invention discloses a high-modulus low-temperature damping silicon resin composition and a preparation method thereof. The composition comprises the following components in parts by weight: 100 parts of organopolysiloxane having a viscosity-average polymerization degree not lower than 5000, 40-60 parts of silicon dioxide powder having specific surface area not lower than 50 m2 / g, 40-60 parts of unsaturated metal carboxylate, 40-90 parts of isobutene-isoprene copolymer and derivatives, and 0.5-5.0 parts of organic peroxide. The high-molecular weight organopolysiloxane and the silicon dioxide are mixed in an open mill or a closed kneader; the unsaturated carboxylate, the organic peroxide and the isobutene-isoprene copolymer are added to the basic material; then the mixture is cured for appropriate time under heating and pressurization; finally, the organic silicon resin composition which is excellent in appearance and homogeneous in interior can be obtained, wherein the modulus of compression of the composition in the range from 20 to 120 MPa, the damping factor of the composition is greater than or equal to 0.2, and the temperature of the composition is in the range from -50 to 0 DEG C.

Description

technical field [0001] The present invention relates to a high-modulus low-temperature damping silicone resin composition and its preparation method, especially the silicone resin composition compounded with unsaturated carboxylic acid metal salt, isobutylene-isoprene copolymer and its derivatives and its preparation method . Background technique [0002] Silicone resin has excellent weather resistance, heat resistance and cold resistance, and its mechanical properties are relatively stable in the temperature range of -50 to 250 ° C. Due to its low glass transition temperature (-70 to -140 ° C), small specific gravity, Low price, easy to form into various shapes, and has good kinetic energy absorption characteristics, widely used as damping material in vibration control and noise control of instrumentation, navigation equipment and electronic systems on various aircraft, ships and vehicles . [0003] The existing silicone damping and vibration-absorbing materials often hav...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L23/22C08K3/36C08K5/098C08K5/14
Inventor 雷卫华罗世凯丁国芳陈立新周安伟曹君宋晏红
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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