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Wafer temperature measuring thermocouple for diffusion furnace

A temperature measuring thermocouple and diffusion furnace technology, applied in the direction of measuring heat, using electrical devices, using electromagnetic means, etc., can solve the problems of increased labor costs and construction period, extended construction period, cumbersome maintenance process, etc., to save production cycle and labor cost, increase production efficiency, and the effect of accurate temperature data

Pending Publication Date: 2018-12-14
SHANGHAI FUYAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Usually, since the positive and negative thermocouple wires are pasted on the wafer by high-temperature-resistant ceramic glue, and the temperature in the furnace will be treated at high or low temperature according to the requirements of the production process, it may cause The ceramic glue falls off due to high-temperature baking, which will not only waste testing time and lead to a longer construction period, but also waste manpower to repair the temperature measurement points on the wafer, which will eventually lead to an increase in product costs and labor costs
[0006] In addition, the temperature measurement points on each wafer need to be connected with two positive and negative thermocouple wires. Although the more distribution points, the more accurate the measurement of temperature uniformity in the diffusion furnace cavity is, but because the thermocouple wires on the wafer distribution points There are many, and this kind of thermocouple wire is extremely fine. The diameter of each thermocouple wire is 0.127mm, so it is directly drawn from the diffusion furnace cavity. When the worker is operating, a little carelessness will cause the thermocouple wire connected to the chip to be pulled. The broken temperature measuring point cannot measure the temperature. After the production must be suspended, local screening and maintenance must be carried out. Because the current process will aggregate the thermocouple wires on the wafer through the heat shrinkable tube, and then heat it with a heat gun. After heating, The heat-shrinkable tube is wrapped outside the thermocouple wire, so the heated heat-shrinkable tube must be disassembled during the maintenance process to sort out the broken thermocouple wire. The maintenance process is very cumbersome, and because there are too many thermocouple wires on the chip, the After falling off, there will be disorder between the threads, which will prolong the screening time and increase the labor cost and construction period

Method used

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  • Wafer temperature measuring thermocouple for diffusion furnace
  • Wafer temperature measuring thermocouple for diffusion furnace
  • Wafer temperature measuring thermocouple for diffusion furnace

Examples

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Embodiment 1

[0027] Such as Figure 1 to Figure 3 As shown, a kind of wafer temperature measuring thermocouple for a diffusion furnace provided by the present invention includes a wafer 1, and said wafer 1 is provided with divergently distributed temperature measuring points 9, usually as follows figure 1 The 17-19 temperature measurement points 9 that are distributed and released as shown, the technical feature of the present invention is to drill a burial hole 13 on each temperature measurement point 9, and on the temperature measurement point 9 in each described burial hole 13 There are thermocouple wire welding joints 10 with positive and negative electrodes, and they are filled and fixed with high-temperature resistant ceramic glue 11, so that the thermocouple wire 2 is closer to the temperature measurement point inside the chip, and the measured temperature data is more accurate; the temperature measurement accuracy is improved, Increase firmness simultaneously; The thermocouple wire...

Embodiment 2

[0033] Such as Figure 5Shown, for the embodiment 2 schematic diagram of a kind of diffusion furnace that the present invention uses wafer temperature measuring thermocouple, because the diameter of the thermocouple wire 2 of positive and negative electrodes drawn from the buried hole 13 of wafer 1 is only 0.027CM, very The temperature measuring points 9 are very fine and distributed on the wafer 1. They have to be drawn directly from the high-temperature furnace to the outside of the furnace, and then pasted and passed through the polyimide structure 3. Therefore, when the workers in the workshop operate, they are slightly careless. The thermocouple wire 2 will be torn off, so a second high-temperature-resistant polymer sleeve 6 of thermocouple wire 2 that can be dispersed and distributed in the polymerization furnace is further added before the polyimide structure 3, and the positive and negative poles After the thermocouple wire 2 passes through the second polymeric sleeve ...

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Abstract

The invention discloses a wafer temperature measuring thermocouple for a diffusion furnace. The wafer temperature measuring thermocouple comprises a wafer; the surface of the wafer is coated with a high-temperature-resistant ceramic adhesive; temperature measuring points distributed divergently are arranged on the wafer; a landfill hole is formed in each temperature measuring point; the landfill holes are filled with thermocouple wire welding joints of positive and negative electrodes; and thermocouple wires are led out from the landfill holes in the wafer, are adhered to a polyimide structurecomposed of two polyimide tapes, penetrate out of the polyimide structure to be connected with a terminal or a socket, and are used with a display instrument or an adjusting device. According to thethermocouple, the holes are formed in the temperature measuring points of the wafer and filled up with the thermocouple wires of the positive and negative electrodes, and welding points of the temperature measuring thermocouple are located at the deeper part in the wafer, so that the measured temperature data is more accurate; and the welding points are not simply adhered to the surfaces of the temperature measuring points of the wafer, so that under the condition of high temperature in the furnace, the welding points are unlikely to fall off compared with the prior art, the production periodand the labor cost are shortened and reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to a temperature-measuring thermocouple, in particular to a wafer temperature-measuring thermocouple for a diffusion furnace, belonging to the technical field of temperature-measuring elements. Background technique [0002] In industrial production process, temperature is one of the important parameters that need to be measured and controlled. In temperature measurement, thermocouples are widely used. Thermocouples are commonly used temperature measuring components in temperature measuring instruments. They directly measure the temperature and convert the temperature signal into a thermal electromotive force signal, which is converted into The temperature of the measured medium. The shapes of various thermocouples are often very different due to needs, but their basic structures are roughly the same, usually composed of main parts such as thermal electrodes, insulating sleeve protection tubes, and junction boxes, and are usually ...

Claims

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Application Information

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IPC IPC(8): G01K7/02
CPCG01K7/02
Inventor 王冬霞张磊叶嘉萍
Owner SHANGHAI FUYAN ELECTRONICS TECH