A kind of stirring method of conductive adhesive

Abstract

The invention discloses a conductive adhesive stirring method. The method comprises the following steps: preparing a conductive adhesive material based on the temperature-returning requirement of theconductive adhesive; weighing the conductive adhesive material according to the use requirement of the conductive adhesive; respectively setting the stirring parameters for a stirring phase and a deaeration phase, wherein the stirring parameters include the rotation speed and the revolution speed; placing the conductive adhesive material in the stirring device, and stirring the conductive adhesivematerial based on the stirring parameters. In the stirring method of the conductive adhesive in the invention, the conductive adhesive is fully stirred by the revolution and the rotation at the sametime, so that the conductive adhesive material is subjected to the centrifugal force in a material cup, and the specific gravity separation movement generated along a vector direction and upward pushing effect generated by the self-weight of the conductive adhesive can separate the bubbles, the cavity number per unit area is greatly reduced, the shear strength of a vibrator can be greatly increased, and the problem of poor resistance consistency is solved, and the product reliability, shock resistance, impact resistance and other characteristics can be improved.

Description

technical field [0001] The invention relates to a stirring method of conductive glue. More specifically, it relates to a stirring method for conductive glue used in crystal components. Background technique [0002] Conductive adhesive is composed of conductive fillers and metals such as silver and copper. It is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. Through the bonding effect of matrix resin Combine the conductive particles together to form a conductive path and realize the conductive connection of the adhered materials. [0003] Since the matrix resin of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for bonding. For example, the epoxy resin adhesive can be cured at room temperature to 150°C, which is much lower than the soldering above 200°C of tin-lead soldering. temperature, which avoids mat...

AI Technical Summary

Problems solved by technology

In the process of stirring, external air bubbles may be introduced, which will lead to the deterioration of the density of the conductive adhesive, and the fixing and supporting effect of the conductive adhesive will be weakened.

The uneven distribution of conductive ions or many internal bubbles of the conductive adhesive after dispensing on the shelf will hinder the movement of conductive particles inside the colloid, making the resistance consistency of the product's electrical performance indicators worse

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