Dry Etching Equipment
A dry etching and equipment technology, applied in the field of dry etching equipment, can solve the problems of uneven thickness of gate insulating layer, fast reaction speed of four corners, uneven color of products, etc. Effect
Active Publication Date: 2020-04-28
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
Existing dry etching equipment exhausts air from the air holes at the four corners of the process chamber through deflectors. Due to the waterfall effect, when the air flow gathers to the four corners, it will flow down rapidly from the air holes, and the products will be taken away quickly, while the reactants will continue to flow to the four corners. , so that the concentration of reactants in the four corners is higher than that in other regions. Due to the high concentration of reactants and the low concentration of products, the reaction speed in four corners is faster than that in other regions, which seriously affects the uniformity of products.
Therefore, it is easy to cause the film thickness of the gate insulating layer to be thinner around, resulting in color shift around the liquid crystal display panel, that is, the uneven film thickness of the gate insulating layer leads to uneven color of the product
Method used
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[0023] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0024] see figure 1 and 2 , the present invention provides a dry etching device, comprising: a chamber body 10, a plurality of air holes 11 provided on the chamber body 10, and a plurality of baffles arranged in the chamber body 10 and correspondingly located on each air hole 11 plate 12;
[0025] The air holes 11 are used to exhaust air to the outside of the cavity 10;
[0026] The baffle 12 is used to cover part of the area of the air hole 11 .
[0027] It should be noted that since the dry etching equipment exhausts air from the cavity 10 through the multiple air holes 11 to maintain the vacuum environment in the cavity 10, due to the waterfall effect, when the airflow gathers to the multiple air holes 11, it will flow rapidly from the...
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Dry etching equipment is provided. The dry etching equipment includes: a cavity, a plurality of air holes arranged in the cavity and a plurality of baffles correspondingly arranged in the cavity and correspondingly located on each air hole, the air holes are used for exhausting toward the outside of the cavity, the baffle plates are used for shielding part of the areas of the air holes, thereby reducing the waterfall effect at the air holes, reducing the etching rate at the plurality of air holes, and improving the etching rate uniformity of the dry etching equipment.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a dry etching device. Background technique [0002] Thin Film Transistor (TFT) is the main driving element in current Liquid Crystal Display (LCD) and Active Matrix Organic Light-Emitting Diode (AMOLED). It is related to the display performance of the flat panel display device. [0003] Most of the liquid crystal displays currently on the market are backlight liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to pour liquid crystal molecules between the thin film transistor substrate (Thin FilmTransistor Array Substrate, TFT Array Substrate) and the color filter (Color Filter, CF) substrate, and apply pixel voltage on the two substrates respectively. and the common voltage, through the electric field formed between the pixel voltage and the common voltage to control the rota...
Claims
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IPC IPC(8): H01J37/32
CPCH01J37/32449H01J2237/3341H01J2237/3343
Inventor 温彦跃
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD