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A manufacturing process of a yin-yang board

A production process, a technology of yin and yang boards, which is applied in printed circuit manufacturing, electrical components, and simultaneous processing of multiple printed circuits. Reduce the effect of wire changing operations

Inactive Publication Date: 2018-12-18
苏州彤帆智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the defects of high cost and long processing time in the prior art, the present invention provides a manufacturing process of yin and yang plates

Method used

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  • A manufacturing process of a yin-yang board

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Embodiment 1

[0030] Refer to attached figure 1 , a manufacturing process of a yin-yang board using 4 pieces is as follows:

[0031] 1) Evaluate whether it can be designed as a yin-yang board:

[0032] a. First of all, there is a heavy component (inductor) on the PCB, which is easy to drop, so adjust the temperature difference between the upper and lower layers of the reflow soldering zone to ensure that the component does not fall. The layer temperature difference increases to above 20°C;

[0033] b. The length of the PCB board is 90cm, and the working range of the placement machine is 460cm*520cm. Since there are protruding parts on the edge of the PCB board, long splicing is used, and the utilization rate of raw materials and the length are too large. It is easy to cause deformation if it is long, so it is combined to use 4 pieces, as attached figure 1 ;

[0034] c. There are about 260 kinds of materials (2600 components) on the 4-panel board, so 3 placement machines are used to moun...

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Abstract

The invention provides a manufacturing process of a yin-yang board, and is characterized in that the manufacturing process comprises the following steps: 1) performing engineering evaluation of whether to design a yin-yang board and whether the yin-yang board has hidden quality danger if spliced; 2) drawing a yin-yang board splicing figure; 3) a PCB manufacturer confirming the jointed board, and requiring the PCB manufacturer to perform sample making, trial production and quality assessment; 4) performing batch production of yin-yang boards; 5) the processing technology of the yin-yang board including the steps of printing, surface mounting, reflow soldering, and AOI. The PCB can be obtained by trimming the yin-yang boards processed by the technology of the invention. Each time of production can reduce SMT line change time by 1H (change to the side B after the production of the side A is completed); surface mounting time of each side can be reduced by 4 seconds of Mark irradiation time(time for irradiation of 2 Marks); the side A and the side B are together, more elements can be mounted on the surface, so that it is more convenient to optimize the 8 elements of the mounting machine for one-time material collection (the mounting machine has 8 suction tubes in a group), and the number of material collection and the number of mounting round trips are reduced; therefore, production of each side can reduce mounting time by 4 seconds; and after changing to the yin-yang board, the overall production capacity of SMT is increased by about 30%.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to a manufacturing process of a yin-yang board. Background technique [0002] SMT is called surface mount or surface mount technology. It is a method of mounting non-lead or short-lead surface mount components (SMC / SMD for short, Chinese chip components) on the surface of a printed circuit board or other substrates. On the surface, it is a circuit assembly technology that is soldered and assembled by methods such as reflow soldering or dip soldering. The SMT production process includes A-side and B-side. The components for processing A-side and B-side are different, and each needs a production line. The setting of two production lines increases the production cost of the product and prolongs the processing time. When the quantity is large, it will be difficult to supply. Contents of the invention [0003] In order to overcome the defects of high cost and long proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/34
CPCH05K3/0097H05K3/34
Inventor 王宏伟李钱欢
Owner 苏州彤帆智能科技有限公司
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