A laser photolithography method PCB solder resist pattern transfer and forming process

Abstract

A laser photolithography PCB solder resist pattern transfer and forming process comprises that following step: 1) surface treatment of the process board: cleaning the surface of the process board to ensure that the surface is coated with ink under the condition of no impurity oxidation; 2) coat photosensitive ink: covering that surface of the whole work plate cop foil by a coating wheel to form anink with uniform thickness; 3) Ink drying: The solvent in the wet ink is evaporated through the uniform temperature of the flintlock furnace to form 18-24UM dry film; 4) laser photoresist pattern: utilizing laser and line pattern data to generate beams with different wavelengths of energy, directly scanning that work plate with photosensitive dry film, and utilizing photochemical molecular bonding principle to solidify and adhere the ink; 5) developing a solder resist pattern: for a solder resist pad pattern by chemical reaction washing of a developing liquid and an ink without molecular bonding; 6) soldering of that solder resist ink: solidifying the ink through a high-temperature oven and a drying path.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing methods, more specifically, it relates to a process for transferring and forming PCB solder mask patterns by laser photolithography. Background technique [0002] The traditional PCB solder resist pattern transfer and molding process is divided into two types, one is the printing process, the other is the exposure and development process, and finally the solder resist pattern formed by these two transfer methods is cured by light or high temperature, so that the ink protects the copper. Foil circuit and base material, leaving only pads to package components, so that the ink has insulation properties and acid and alkali resistance, and chemical solvent properties. [0003] The process of the printing process is to make graphics data by computer → lightly draw the solder mask pattern on the positive film → the film pattern is transferred to the image printing screen through exposure ...

AI Technical Summary

Problems solved by technology

Among them, there are problems in the accuracy of the film line and the size of the graphic size in the photo-painted solder mask negative film, and the accuracy is controlled at ±0.05MM. At the same time, there is a problem with the consistency of multiple copies of the film. The accuracy is controlled at ±0.10MM, and the film is affected by the storage environment. Changes lead to the shrinkage and deformation accuracy of the film being controlled at ±0.15MM, and the total accuracy deviation exceeds 0.15MM