A laser photolithography PCB line pattern transfer and forming process

Abstract

A laser photolithography PCB line pattern transfer and forming process includes such steps as 1) technique plate surface processing: cleaning that surface of process board, coating ink without impurity oxidation on the surface of process board, 2) coat photosensitive ink: covering that surface of the whole work plate cop foil by a coating wheel to form an ink with uniform thickness; 3) solidify that ink: evaporating the solvent in the wet ink to form a dry film through a uniform temperature of a flintlock furnace; 4) photolithography circuit pattern: generate beams with different wavelength energy by utilizing laser and circuit pattern data, and directly scan that working plate with photosensitive dry film; 5) developing that circuit diagram: washing the circuit diagram by chemical reaction of developing solution and ink to form protective etching-resistant circuit diagram; 6) etching the circuit to remove ink: etching the circuit by alkaline or acidic solution to form a circuit, and then remove ink on the circuit by alkaline film removing solution.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing methods, more specifically, it relates to a process for transferring and forming PCB circuit patterns by laser photolithography. Background technique [0002] The traditional PCB circuit pattern transfer and molding process is divided into two types, one is the printing process, the other is the exposure and development process, and the circuit pattern formed by these two transfer methods is made into a copper foil circuit through acid and alkaline etching chemical reactions. layer. [0003] The process of printing process is to make graphics data by computer → lightly draw the circuit graphics positive film → the film graphics are transferred to the printing screen through exposure and become a negative image → the printing machine scrapes the screen printing ink to the copper foil to form the circuit to be etched Protect graphics. There are problems with the accuracy of the fil...

AI Technical Summary

Problems solved by technology

This process has problems with the length and accuracy of film lines and graphics, and the accuracy is controlled at ±0.05MM. At the same time, there is a problem with the consistency of multiple copies of the film. The accuracy is controlled at ±0.10MM, and the shrinkage and deformation accuracy of the film is caused by changes in the storage environment. Controlled at ±0.15MM, the total precision deviation exceeds 0.15MM