Anti-oxidation conveying device for integrated circuit board production

Abstract

The invention discloses an anti-oxidation conveying device for integrated circuit board production. The anti-oxidation conveying device comprises a supporting frame, a fixing table and a sliding groove, wherein the right side of the supporting frame is connected with a conveying belt, and a rotating rod is installed inside the conveying belt; the upper end of a sliding table is connected with a sliding rod, a first rotating shaft is installed inside the supporting rod, and a fixing clamp is fixed to the left side of the supporting rod; and a telescopic spraying pipe is connected to the inner side of the fixing clamp, and a water pump is installed on the left side of the lower end of the telescopic spraying pipe. According to the spraying requirement of the integrated circuit board, a sliding block can slide left and right on the sliding groove in the inner side of the sliding table through a sliding wheel, so that the position of the supporting rod is adjusted; the supporting rod rotates through the first rotating shaft, so that the spraying orientation of the telescopic spraying pipe can be adjusted; and chemical can be sprayed on the integrated circuit board through the telescopic spraying pipe, the chemical is attached to the surface of the integrated circuit board, so that copper substances in the integrated circuit board are prevented from being oxidized.

Description

technical field [0001] The invention relates to the technical field of integrated circuit boards, in particular to an anti-oxidation conveying device for the production of integrated circuit boards. Background technique [0002] The integrated circuit board uses semiconductor manufacturing technology to manufacture many transistors, resistors, capacitors and other components on a small single crystal silicon chip, and combines the components into a complete circuit board according to the method of multi-layer wiring or tunnel wiring. Electronic circuits and circuit boards are generally formed by etching chemical raw materials such as ferric chloride. Although they are washed with water after molding, there are still traces of corrosion components, which can easily cause copper thin oxidation and corrosion to cause copper rust and affect circuit performance. [0003] At present, the existing conveying devices for the production of integrated circuits on the market generally u...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide an anti-oxidation transmission device for integrated circuit board production, which solves the problem that the existing transmission device for integrated circuit production generally adopts drying treatment for circuit boards, so that the copper substances on the circuit boards are quickly oxidized. Oxidation in tiny pores cannot be cleaned, resulting in a large number of defective products and waste of raw materials

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