Passivation method of semiconductor laser cavity surface and semiconductor laser
A laser and semiconductor technology, applied in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of cavity surface damage, affecting the output power and life of semiconductor lasers, etc., to improve reliability, solve bonding and passivation effects, key big effect
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[0026] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0027] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0028] Such as figure 1 As shown, the passivation method of the semiconductor laser cavity surface provided by the embodiment of the present invention includes the following steps S1 to S8:
[0029] S1, cleave the semiconductor laser epitaxial wafer into bars in the air, put it into the coating fixture and put it into the magnetron sputtering vacuum chamber.
[0030] S2, turn on the hydrogen source in the magnetron sputtering vacuum chamber, and generate hydrogen plasma by sputtering hydrogen gas with 100-150W radio frequency power, and use the hydrogen plasma to...
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