Method for machining key part on semiconductor encapsulation equipment

Abstract

The invention relates to a method for machining a key part on semiconductor encapsulation equipment. A rectangular Peek plate is located and clamped on a bench clamp of a vertical milling machine, andthe lower surface, the upper surface and the side faces are subjected to rough machining; the lower surface and the upper surface are subjected to rough machining on a grinding machine; the upper surface is machined through a stainless steel four-blade milling cutter, and bottom holes of threaded holes are drilled in the upper surface through a twist drill; bottom holes of bolt holes and stainless steel locating holes are subjected to rough machining through a four-blade tungsten steel milling cutter; bottom holes of black light sensing original points are drilled in the upper surface throughthe twist drill, and assembly holes of the black light sensing original points are machined through a drill bit; the lower surface is subjected to finish machining through the stainless steel four-blade milling cutter; stainless steel bushes are mounted on the bottom holes of the stainless steel locating holes; black PEEK cylinders are mounted on the bottom holes of the black light sensing original points; the stainless steel bushes of the stainless steel locating holes are subjected to rough machining through the four-blade tungsten steel milling cutter, the stainless steel locating holes are subjected to finish machining through the four-blade tungsten steel milling cutter, and the stainless steel locating holes are formed; the upper surface and the lower surface are subjected to finishmachining through a tungsten steel grinding wheel; and an encapsulation position groove is subjected to rough machining through the four-blade tungsten steel milling cutter.

Description

technical field [0001] The invention relates to a processing method for core components on semiconductor packaging equipment. Background technique [0002] At present, the common processing method not only needs to prevent the collapse of the PEEK material during processing, but also ensures the surface finish and the position of the groove size. It is difficult to guarantee the processing quality and processing efficiency in single-piece processing. The existing processing technology is small. Batch processing. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for processing core components on semiconductor packaging equipment. [0004] The purpose of the present invention is achieved through the following technical solutions: [0005] The method for processing core parts on semiconductor packaging equipment is characterized in that it includes the following steps: [0006] 1) P...

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Problems solved by technology

[0002] At present, the common processing method not only needs to prevent the collapse of the PEEK material during processing, but also ensures the surface finish and the position of t

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