Lift pin systems, vacuum reaction chambers, and semiconductor processing equipment

Abstract

The embodiment of the present invention discloses a lifting needle system, a vacuum reaction chamber and a semiconductor processing equipment, wherein the lifting needle system includes: a focusing ring, an electrostatic chuck, a focusing ring lifting device and a wafer lifting needle lifting device; The ring lift device includes: a focus ring thimble and a first lift drive device, the first lift drive device drives the focus ring thimble to lift or lower, so as to lift or lower the focus ring; the wafer lift pin lift device includes: a wafer lifter The dome pin and the second lift driving device, the second lift driving device drives the wafer ejector pin to lift or lower, so as to lift or lower the wafer placed on the focus ring. The system, the vacuum reaction chamber and the equipment of the present invention can improve the abnormal maintenance efficiency; by accurately raising the height of the focus ring after a predetermined process time, the service life of the focus ring is doubled; The focus ring can be replaced under certain circumstances to improve the efficiency of replacing consumables.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated manufacturing, in particular to a lifting pin system, a vacuum reaction chamber and semiconductor processing equipment. Background technique [0002] The reaction chamber of the plasma etching machine is in a vacuum state when it is working. Generally, one transfer platform is connected to two to four reaction chambers of the etching machine. The wafer is transferred to the corresponding position in the reaction chamber of the etching machine through the transfer platform manipulator at the atmospheric end. The lifting needle mechanism of the etching machine performs the needle lifting action. The platform vacuum robot places the wafer on the needle lifting mechanism and withdraws it. The mechanism descends, and the wafer falls to the corresponding position of the electrostatic chuck. The wafer is adsorbed on the electrostatic chuck during the process. After the processing is com...

AI Technical Summary

Problems solved by technology

After multiple etching operations, there is residual static electricity in the electrostatic chuck and the distribution is uneven. When the lifting pin mechanism lifts up the wafer through three thin needles, it is easy to cause uneven load distribution, wafer jumping causes position deviation, and even causes Tilting out of position, the manipulator cannot transfer, and can only shut down and open the reaction chamber to manually pick up the wafer, resulting in the risk of wafer scrapping and increased maintenance costs

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