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Single-component anaerobic adhesive for preventing slice falling during cutting and preparation method thereof

An anaerobic adhesive, anti-cutting technology, used in adhesives, modified epoxy resin adhesives, adhesive types, etc., can solve problems such as silicon wafer damage, increase polarity, increase bonding strength, adapt to strong effect

Inactive Publication Date: 2019-01-15
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing diamond wire cutting silicon ingot method, the silicon ingot and the resin plate are fixedly connected with a single-component anaerobic adhesive, and the diamond wire cuts the silicon ingot into a thin silicon wafer, and the silicon wafer is easily fixed from the resin plate below. If it falls off and is damaged, a one-component anaerobic adhesive with good bonding strength is needed to make the silicon wafer stably fixed on the resin board without degumming and falling off, so as to protect the integrity of the silicon wafer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A one-component anaerobic adhesive that prevents cutting and falling off. The preparation components include: 45 parts by mass of hydroxypropyl methacrylate, 30 parts by mass of polyurethane acrylate, 4 parts by mass of epoxy vinyl ester resin, 1 mass part part of accelerator, 0.5 parts by mass of modified acrylate phosphate compound, 1 part by mass of peroxide initiator, and 1 part by mass of inhibitor, wherein the modified acrylate phosphate compound consists of 2 -Hydroxyethyl methacrylate phosphate and ester compounds with allyl double bonds are produced by copolymerization. The ester compounds with allyl double bonds are one of methacrylic acid and methyl methacrylate kind.

[0024] The preparation method of the one-component anaerobic adhesive of anti-cutting chip comprises the following steps:

[0025] Step 1. In parts by mass, weigh hydroxypropyl methacrylate, urethane acrylate, and epoxy vinyl ester resin into the reaction kettle, stir, weigh the polymerizatio...

Embodiment 2

[0028] A one-component anaerobic adhesive that prevents cutting and falling off. The preparation components include: 52 parts by mass of hydroxypropyl methacrylate, 38 parts by mass of polyurethane acrylate, 8 parts by mass of epoxy vinyl ester resin, 2 parts by mass of part of accelerator, 1 mass part of modified acrylate phosphate compound, 2 mass parts of peroxide initiator, and 1 mass part of polymerization inhibitor, wherein the modified acrylate phosphate compound consists of 2 -Hydroxyethyl methacrylate phosphate and ester compounds with allyl double bonds are produced by copolymerization. The ester compounds with allyl double bonds are one of methacrylic acid and methyl methacrylate kind.

[0029] The preparation method of the one-component anaerobic adhesive of anti-cutting chip comprises the following steps:

[0030] Step 1. In parts by mass, weigh hydroxypropyl methacrylate, urethane acrylate, and epoxy vinyl ester resin into the reaction kettle, stir, weigh the po...

Embodiment 3

[0033] A one-component anaerobic adhesive that prevents cutting and falling off. The preparation components include: 48 parts by mass of hydroxypropyl methacrylate, 34 parts by mass of polyurethane acrylate, 6 parts by mass of epoxy vinyl ester resin, 1.5 parts by mass part of accelerator, 0.7 parts by mass of modified acrylate phosphate compound, 1.5 parts by mass of peroxide initiator, and 1 part by mass of inhibitor, wherein the modified acrylate phosphate compound consists of 2 -Hydroxyethyl methacrylate phosphate and ester compounds with allyl double bonds are produced by copolymerization. The ester compounds with allyl double bonds are one of methacrylic acid and methyl methacrylate kind.

[0034] The preparation method of the one-component anaerobic adhesive of anti-cutting chip comprises the following steps:

[0035] Step 1. In parts by mass, weigh hydroxypropyl methacrylate, urethane acrylate, and epoxy vinyl ester resin into the reaction kettle, stir, weigh the poly...

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PUM

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Abstract

The invention discloses a single-component anaerobic adhesive for preventing slice falling during cutting and a preparation method thereof. The anaerobic adhesive includes the preparation components:45-52 parts by mass of hydroxypropyl methacrylate, 30-38 parts by mass of polyurethane acrylate, 4-8 parts by mass of epoxy vinyl ester resin, 1-2 parts by mass of an accelerator, 0.5-1 part by mass of a modified acrylate phosphate compound, 1-2 parts by mass of a peroxide initiator, and 1 part by mass of a polymerization inhibitor, wherein the modified acrylate phosphate compound is prepared by copolymerization reaction of 2-hydroxyethyl methacrylate phosphate with allyl double-bond ester compounds. The single-component anaerobic adhesive has high bonding strength, so that a silicon slice anda resin plate are stably connected and degumming and slice-falling phenomena are not generated, and the single-component anaerobic adhesive has the beneficial effect of protecting the integrity of the silicon slice.

Description

technical field [0001] The present invention relates to the field of glue. More specifically, the present invention relates to a one-component anaerobic adhesive that is anti-cutting and a preparation method thereof. Background technique [0002] In the existing diamond wire cutting silicon ingot method, the silicon ingot and the resin plate are fixedly connected with a single-component anaerobic adhesive, and the diamond wire cuts the silicon ingot into a thin silicon wafer, and the silicon wafer is easily fixed from the resin plate below. If it falls off and is damaged, a one-component anaerobic adhesive with good bonding strength is needed to stably fix the silicon wafer on the resin board without degumming and falling off, so as to protect the integrity of the silicon wafer. Contents of the invention [0003] It is an object of the present invention to solve at least the above-mentioned problems and to provide at least the advantages which will be described later. ...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J163/10C09J143/02
CPCC08L2205/03C09J175/14C08L63/10C08L43/02
Inventor 潘方立苏光临陈韬陆钟世黄福旦潘永强
Owner 广西珀源新材料有限公司