Resonant accelerometer based on bident type resonant beam
A technology of accelerometer and resonant beam, which is applied in the direction of measuring acceleration, speed/acceleration/impact measurement, measuring device, etc. It can solve the problem of reducing measurement sensitivity and achieve the effect of high detection sensitivity
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[0028] Embodiment 1: The thickness of the original silicon wafer is 389 microns, the thickness of the double-pronged fork-shaped resonant beam (1) is 3 microns, the thickness of the crab-leg support beam (4) is 25 microns, and the width of the corrosion groove (8) is 660 microns. The production process determined based on the above data is as follows:
[0029] 1) The original silicon wafer is (100) double-sided polished silicon wafer with a thickness of 389 microns. Thermal oxidation, a silicon dioxide film with a thickness of 0.6 microns is produced on the front and back sides of the silicon wafer in the (100) crystal orientation, and a silicon nitride film with a thickness of 0.3 microns is produced on the front and back sides of the silicon wafer by low-pressure chemical vapor deposition. (See figure 2 [1])
[0030] 2) Combining photolithography, corrosion, and doping processes to fabricate the excitation resistor (2) and piezoresistor (3) of the double-pronged fork-shap...
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