Thin-film heating plate assembly and electronic equipment
A technology for electronic equipment and heating plates, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of excessive heating temperature rise, poor heating effect, uneven temperature distribution, etc., to ensure quality and efficiency, and improve practicality. resistance, avoid the effect of uneven heating
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[0030] The specific embodiments of the present invention will be described in further detail below in conjunction with the drawings and embodiments. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.
[0031] In the present invention, the terms "installation", "connection", "fixation" and other terms should be understood broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " The orientation or positional relationship indicated by “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”,...
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