Laser melting deposition method of ceramic reinforced high-entropy alloy composite component

A composite material component, laser melting deposition technology, applied in the direction of additive processing, energy efficiency improvement, process efficiency improvement, etc., can solve the constraints of ceramic reinforced high entropy alloy composite component preparation and application, ceramic reinforced high entropy alloy composite There are many steps in material components, uneven distribution of reinforcement phases, etc., to achieve the effect of controllable internal structure, solving poor internal quality, and uniform distribution of reinforcement phases

Inactive Publication Date: 2019-02-01
MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

However, ceramic powder has a very high melting point (WC melting point 2875°C, TiC melting point 3140°C, etc.), if the traditional melting and casting method is used to prepare ceramic reinforced high-entropy alloy composite components, it will inevitably lead to uneven distribution of the reinforcing phase, and the melting and casting The preparation of ceramic reinforced high-entropy alloy composite components is easy to introduce defects such as composition segregation, voids and shrinkage cavities.
In addition, the preparation of ceramic-reinforced high-entropy alloy composite components by melting and casting has many steps, complex processes, and large machining allowances, so the preparation cycle is long, the manufacturing cost is high, and the material utilization rate is low.
The combination of these problems seriously restricts the preparation and application of ceramic reinforced high-entropy alloy composite components.

Method used

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  • Laser melting deposition method of ceramic reinforced high-entropy alloy composite component
  • Laser melting deposition method of ceramic reinforced high-entropy alloy composite component
  • Laser melting deposition method of ceramic reinforced high-entropy alloy composite component

Examples

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example 1

[0041] In this example, the laser melting deposition method is used to prepare a single-wall ceramic reinforced high-entropy alloy composite component. The process includes the following steps:

[0042] (1) Preparation of raw materials:

[0043] FeCoNiCrMn spherical alloy powder with an average particle size of 100 μm, WC spherical ceramic powder with an average particle size of 10 μm, stainless steel substrate;

[0044] (2) Raw material handling:

[0045] Mix FeCoNiMnCr-like spherical alloy powder and WC-like spherical ceramic powder at an atomic ratio of 9:1, bake in a vacuum oven at 120°C for 2 hours, then cool naturally, and put it into the barrel of the powder feeder after cooling; use No. 800 sandpaper Mechanically grind the stainless steel substrate, and immerse the polished substrate in acetone in a beaker, and then place them together in an ultrasonic cleaning device for cleaning, and then repeat the steps of grinding, immersion, and cleaning at least once, and the c...

example 2

[0053] This example uses the laser melting deposition preparation method to prepare ceramic reinforced high-entropy alloy composite component blocks. The process uses the same powder and laser additive manufacturing process as Example 1. The difference lies in path planning and code generation: The 3D model of the block is layered and sliced, and each layer can be overlapped by single-line scanning. The single-channel overlapping rate of each layer is 30% to 60%. After each layer is completed, the Z-axis of the machine tool is raised by a certain amount. The height continues to scan and accumulate, but the scanning direction is perpendicular to the previous layer, so that the circular accumulation becomes a block, that is, the scanning and melting deposition is performed like a checkerboard, such as image 3 shown. Finally, the ceramic reinforced high-entropy alloy composite component block sample is obtained, as shown in Figure 4 shown.

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Abstract

The invention discloses a laser melting deposition method of a ceramic reinforced high-entropy alloy composite component. The method includes the following steps that (1) raw materials are prepared; (2) the raw materials are treated; (3) a path of a laser layer-by-layer melted accumulated reinforced phase high-entropy alloy is planned; and (4) a reinforced phase high-entropy alloy component is subjected to laser stereoscopic forming. The laser melting deposition technology is creatively applied to preparation of the ceramic reinforced high-entropy alloy composite component, process parametersof laser melting deposition of the ceramic reinforced high-entropy alloy composite component are explored, the restriction technical problem of laser melting deposition of the ceramic reinforced high-entropy alloy composite component is solved, and the method has great significance in research and application of the component.

Description

technical field [0001] The invention relates to the field of material science and advanced manufacturing, in particular to a laser melting deposition method for a ceramic reinforced high-entropy alloy composite material component. Background technique [0002] Due to its high strength, good wear resistance, high work hardening, high temperature softening resistance, high temperature oxidation resistance, corrosion resistance and radiation resistance, high-entropy alloy material components have important roles in nuclear power, anti-corrosion and military fields. Application prospect. Even so, in many cases, the original performance of high-entropy alloy material components is not enough to meet the needs of some special environments, and its performance needs to be improved at this time. [0003] We found that the performance of high-entropy alloy components can be improved by using ceramic-reinforced high-entropy alloy composite components, and the performance of ceramic-r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B33Y10/00
CPCB33Y10/00B22F10/00B22F10/36B22F10/25B22F10/366Y02P10/25
Inventor 李晋锋向硕刘学乐国敏王斗马诗雨胡立威
Owner MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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