Detachable packaging structure and preparation method thereof
A packaging structure and device structure technology, applied in the field of detachable packaging structure and its preparation, can solve the problems of large size of the overall packaging structure, unremovable top cover, poor applicability of MEMS devices, etc.
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Embodiment 1
[0041] see figure 1 , this embodiment provides a preparation method of a detachable packaging structure, and the preparation method of the detachable packaging structure includes the following steps:
[0042] 1) Provide a substrate;
[0043] 2) forming a groove on the upper surface of the substrate;
[0044] 3) forming a MEMS device structure in the groove;
[0045] 4) Provide a detachable cover plate, and clamp the detachable cover plate in the groove to form a sealed cavity between the detachable cover plate and the bottom of the groove; the MEMS device structure sealed in the sealed cavity.
[0046] In step 1), see figure 1 Step S1 in and figure 2 , a substrate 10 is provided.
[0047] As an example, the substrate 10 may include, but is not limited to, a silicon wafer. Preferably, in this embodiment, the substrate 10 may be a silicon wafer with a crystal orientation.
[0048] In step 2), see figure 1 Step S2 in and image 3 , a groove 11 is formed on the upper su...
Embodiment 2
[0073] please continue Figure 5 to Figure 7 , the present invention also provides a detachable package structure, the detachable package structure can be prepared by but not limited to the preparation method described in the first embodiment, the detachable package structure includes: a substrate 10, the substrate A groove 11 is formed on the upper surface of the 10; a removable cover 13, the removable cover 13 is clamped inside the groove 11, so that the removable cover 13 and the bottom of the groove 11 A sealed cavity 14 is formed therebetween; the MEMS device structure 12 is sealed in the sealed cavity 14 .
[0074] As an example, the substrate 10 may include, but is not limited to, a silicon wafer. Preferably, in this embodiment, the substrate 10 may be a silicon wafer with a crystal orientation.
[0075] As an example, the shape of the longitudinal section of the groove 11 can be set according to actual needs, and the shape of the longitudinal section of the groove 11...
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