Manufacturing method of Sip module with electromagnetic shielding structure and device

An electromagnetic shielding structure and electromagnetic shielding technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high integration of Sip, large shielding slot size, and high fixture cost, and achieve small occupied space and production cost. The effect of low and low production cost

Pending Publication Date: 2019-02-01
HUANWEI ELECTRONICS SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the existing intermediate shielding layer is installed, it is generally first to open a groove on the adhesive layer on the substrate, and fill the groove with liquid shielding glue by spraying, so as to form the electromagnetic shielding in the Sip product. This process In the method, the size of the shielding groove is large, the UPH (Unit Per Hou

Method used

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  • Manufacturing method of Sip module with electromagnetic shielding structure and device
  • Manufacturing method of Sip module with electromagnetic shielding structure and device
  • Manufacturing method of Sip module with electromagnetic shielding structure and device

Examples

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Example Embodiment

Specific embodiment one

[0035] combine Figures 1 to 5As shown, this specific embodiment discloses a manufacturing method of a SiP module with an electromagnetic shielding structure, comprising the steps of:

[0036] S1, make the substrate 1, such as figure 1 As shown, the substrate 1 includes a support layer 11, a conductive layer 12 and an insulating layer 13 that are stacked in sequence from bottom to top. The substrate 1 is preset with a number of single SiP module layout areas and cutting for separating the single SiP modules. In the insulating layer 13, a spaced conductive end 14 is arranged in the layout area of ​​a single SiP module, in the insulating layer 13, an edge conductive end 15 is provided on the cutting track, and the lower end faces of the spaced conductive end 14 and the edge conductive end 15 are respectively The conductive layers 12 are connected, and the upper end surfaces of the spaced conductive ends 14 and the edge conductive ends 15 are exposed on...

Example Embodiment

Specific embodiment two

[0046] combine figure 1 , 2 As shown, this specific embodiment discloses a SiP module to be coated with electromagnetic shielding glue, including a substrate 1, a plurality of electronic components and a plastic sealing layer 3. The substrate 1 includes a supporting layer 11, The conductive layer 12 and the insulating layer 13 are preset on the substrate 1 with a number of single SiP module layout areas and dicing lanes used to separate the single SiP modules. In the insulating layer 13, the single SiP module layout area is arranged with a spaced conductive layer. End 14, the edge conductive end 15 is arranged in the insulating layer 13 and on the cutting track, the lower end surfaces of the spaced conductive end 14 and the edge conductive end 15 are respectively connected to the conductive layer 12, and the upper end surface of the spaced conductive end 14 and the edge conductive end 15 is connected to the substrate The upper end surface of 1 is flu...

Example Embodiment

Specific embodiment three

[0052] like image 3 As shown, this specific embodiment discloses an electromagnetic shielding glue coating device, which is used to implement the manufacturing method of the SiP module with the electromagnetic shielding structure in the specific embodiment 1, including a vacuum chamber 4, a dispensing head (not shown in the figure) shown) and the moving scraper 5, the vacuum chamber 4 provides a vacuum environment for the SiP module to be coated with electromagnetic shielding glue, so that the common type shielding groove 31 and the interval shielding groove 32 in the SiP module to be coated with electromagnetic shielding glue are are in a vacuum state, and the dispensing head is used to provide shielding glue 7 to the upper surface of the SiP module to be coated with electromagnetic shielding glue. The movable scraper 5 is located in the vacuum chamber 4. In the working state, the movable scraper 5 is located on the upper surface of the SiP module...

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Abstract

The present invention discloses a manufacturing method of Sip (System In a Package) module with an electromagnetic shielding structure and a device. An SiP module to be subjected to coating of electromagnetic shielding glue is manufactured, The SiP module comprises a substrate, a plurality of electronic elements and a plastic package layer, the substrate comprises a support layer, a conductive layer and an insulation layer, the insulation layer is internally provided with an interval conductive terminal and an edge conductive terminal, the lower end faces of the two conductive terminals are connected with a conductive layer, and the upper end faces of the two conductive terminals are in level in the upper end face of the substrate; the electronic element is welded at the upper surface of the substrate, and the electronic element having an anti-electromagnetic interference requirement is independently arranged at one side of the interval conductive terminal; the plastic package layer coats the electronic element; the plastic package layer is internally provided with an interval shielding groove and a conformal shielding groove cutting through the plastic package layer from top to bottom, and shielding glue fills in the interval shielding groove and the conformal shielding groove in a vacuum coating mode. The SiP module manufacturing method can allow the interval shielding layerand the conformal shielding layer at the same time, is simple in coating device, low in manufacturing cost and few in manufacturing process, can save the glue materials and can reduce the product cost.

Description

technical field [0001] The invention relates to the improvement of Sip packaging (System In a Package system-level packaging) process technology, in particular to a manufacturing method and device of a Sip module with an electromagnetic shielding structure. Background technique [0002] SIP packaging (System In a Package) integrates multiple functional chips, including processors, memory and other functional chips, into one package to achieve a basically complete function. In order to prevent the internal signals of electronic products from being interfered or interfere with each other, resulting in a decrease in the communication quality, it is generally necessary to set an intermediate shielding layer in the electronic product to isolate electronic components with different functions, and the outermost layer of the electronic product is provided with a common type shielding layer, and the intermediate shielding layer Both the shielding layer and the common type shielding l...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/56H01L23/552H01L23/31H01L21/67
CPCH01L21/50H01L21/56H01L21/67126H01L23/3121H01L23/552H01L2224/16227H01L2924/3025
Inventor 李瑶张林赵保杰
Owner HUANWEI ELECTRONICS SHANGHAI CO LTD
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