Manufacturing method of Sip module with electromagnetic shielding structure and device

An electromagnetic shielding structure and electromagnetic shielding technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high integration of Sip, large shielding slot size, and high fixture cost, and achieve small occupied space and production cost. The effect of low and low production cost

Pending Publication Date: 2019-02-01

HUANWEI ELECTRONICS SHANGHAI CO LTD

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AI-Extracted Technical Summary

Problems solved by technology

When the existing intermediate shielding layer is installed, it is generally first to open a groove on the adhesive layer on the substrate, and fill the groove with liquid shielding glue by spraying, so as to form the electromagnetic shielding in the Sip product. This process In the method, the size of the shielding groove is large, the UPH (Unit Per Hou...

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Abstract

The present invention discloses a manufacturing method of Sip (System In a Package) module with an electromagnetic shielding structure and a device. An SiP module to be subjected to coating of electromagnetic shielding glue is manufactured, The SiP module comprises a substrate, a plurality of electronic elements and a plastic package layer, the substrate comprises a support layer, a conductive layer and an insulation layer, the insulation layer is internally provided with an interval conductive terminal and an edge conductive terminal, the lower end faces of the two conductive terminals are connected with a conductive layer, and the upper end faces of the two conductive terminals are in level in the upper end face of the substrate; the electronic element is welded at the upper surface of the substrate, and the electronic element having an anti-electromagnetic interference requirement is independently arranged at one side of the interval conductive terminal; the plastic package layer coats the electronic element; the plastic package layer is internally provided with an interval shielding groove and a conformal shielding groove cutting through the plastic package layer from top to bottom, and shielding glue fills in the interval shielding groove and the conformal shielding groove in a vacuum coating mode. The SiP module manufacturing method can allow the interval shielding layerand the conformal shielding layer at the same time, is simple in coating device, low in manufacturing cost and few in manufacturing process, can save the glue materials and can reduce the product cost.

Application Domain

Semiconductor/solid-state device detailsSolid-state devices +2

Technology Topic

Electromagnetic interferenceEngineering +6

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Examples

Experimental program(3)

Example Embodiment

Specific embodiment one

[0035] combine Figures 1 to 5As shown, this specific embodiment discloses a manufacturing method of a SiP module with an electromagnetic shielding structure, comprising the steps of:

[0036] S1, make the substrate 1, such as figure 1 As shown, the substrate 1 includes a support layer 11, a conductive layer 12 and an insulating layer 13 that are stacked in sequence from bottom to top. The substrate 1 is preset with a number of single SiP module layout areas and cutting for separating the single SiP modules. In the insulating layer 13, a spaced conductive end 14 is arranged in the layout area of a single SiP module, in the insulating layer 13, an edge conductive end 15 is provided on the cutting track, and the lower end faces of the spaced conductive end 14 and the edge conductive end 15 are respectively The conductive layers 12 are connected, and the upper end surfaces of the spaced conductive ends 14 and the edge conductive ends 15 are exposed on the upper surface of the substrate 1 and are flush with the upper end surface of the substrate 1;

[0037] S2. Electronic components 21, electronic components 22 and electronic components 23 are welded on the single SiP module layout area on the upper surface of the substrate 1, and the electronic components 21 with anti-electromagnetic interference requirements are separately arranged on the side of the spaced conductive end 14, The electronic components 22 and 23 are arranged on the other side of the spaced conductive ends 14;

[0038] S3, forming a plastic encapsulation layer 3 on the upper surface of the substrate 1, and the plastic encapsulation layer 3 covers all the electronic components to obtain the following figure 1 SiP module shown;

[0039] S4, in figure 1 A common type shielding groove 31 and an interval shielding groove 32 are opened on the plastic sealing layer 3 in the SiP module shown in the figure. The spaced shielding groove 32 is opened just above the spaced conductive end 14, so that the upper end surface of the spaced conductive end 14 is exposed, so as to obtain the following figure 2 The shown SiP module to be coated with electromagnetic shielding glue;

[0040] S5, such as image 3 As shown, the SiP module obtained in step S4 is placed in the vacuum chamber 4 of the electromagnetic shielding glue coating device, and the electromagnetic shielding glue coating process is carried out: the shielding glue 7 is placed on the upper surface of the plastic sealing layer 3 of the SiP module, Use a moving scraper 5 to reciprocate along the upper surface of the plastic sealing layer 3 of the SiP module, so that the shielding glue fills the common type shielding groove 31 and the spaced shielding groove 32, and forms a layer on the upper surface of the plastic sealing layer 3 of the SiP module. layer shield 8 to obtain as Figure 4 SiP module shown;

[0041] S6. Split along the cutting track to form such as Figure 5 Shown is a single SiP module with electromagnetic shielding structure.

[0042] In this embodiment, the step S5 further includes a step S51: placing a blocking piece 6 on the SiP module obtained in the step S4, the blocking piece 6 is a frame structure, and the blocking piece 6 only covers the plastic seal of the SiP module The edge of the upper surface of the layer 3 exposes a single SiP module, including exposing the spaced shielding groove 32, the common shielding groove 31 and the upper surface of the plastic sealing layer 3 in the single SiP module. The setting of the baffle 6 can be It can effectively prevent the excess shielding glue from contaminating the plastic sealing layer 3 of the SiP module, and it is also easy to clean up the excess shielding glue.

[0043] In this embodiment, the conductive layer 12 in the substrate 1 is a copper layer, and the spaced conductive ends 14 and the edge conductive ends 15 are both copper blocks.

[0044] The method for providing the electromagnetic shielding layer in the present invention is simple in process, easy to operate, can save shielding materials and costs, and can effectively improve the output per unit time of the Sip product when the electromagnetic shielding layer is provided.

[0045] Of course, in other specific embodiments of the Sip module with the electromagnetic shielding structure of the present invention, the number of electronic components in the layout area of a single SiP module, the number of spaced conductive ends, and the arrangement relationship between the spaced conductive ends and the electronic components can be adjusted according to actual needs; step S51 can be selectively set; the conductive layer in the substrate, the spaced conductive terminals and the edge conductive terminals can be selected from other conductive materials as required, which will not be repeated here.

Example Embodiment

Specific embodiment two

[0046] combine figure 1 , 2 As shown, this specific embodiment discloses a SiP module to be coated with electromagnetic shielding glue, including a substrate 1, a plurality of electronic components and a plastic sealing layer 3. The substrate 1 includes a supporting layer 11, The conductive layer 12 and the insulating layer 13 are preset on the substrate 1 with a number of single SiP module layout areas and dicing lanes used to separate the single SiP modules. In the insulating layer 13, the single SiP module layout area is arranged with a spaced conductive layer. End 14, the edge conductive end 15 is arranged in the insulating layer 13 and on the cutting track, the lower end surfaces of the spaced conductive end 14 and the edge conductive end 15 are respectively connected to the conductive layer 12, and the upper end surface of the spaced conductive end 14 and the edge conductive end 15 is connected to the substrate The upper end surface of 1 is flush, a plurality of electronic components 21, 22 and 23 are welded on the upper surface of the insulating layer 13 of the substrate 1, and in the layout area of a single SiP module, the electronic components 21 with anti-electromagnetic interference requirements are separately arranged in the On one side of the spaced conductive ends 14 , the electronic components 22 and 23 are arranged on the other side of the spaced conductive ends 14 . The plastic encapsulation layer 3 is disposed on the upper surface of the substrate 1 and covers the electronic components 21 , 22 and 23 .

[0047] A common type shielding groove 31 and an interval shielding groove 32 are opened in the plastic sealing layer 3. The common type shielding groove 31 and the spaced shielding groove 32 respectively penetrate the plastic sealing layer 3 from top to bottom. The common type shielding groove 31 and the edge conductive end 15 are one by one. Correspondingly, the common type shielding groove 31 is opened directly above the edge conductive end 15 so that the upper end surface of the edge conductive end 15 is exposed. It is connected to the edge ground terminal 15 , and the shielding glue in the common type shielding groove 31 is connected to the conductive layer 12 in the substrate 1 through the edge ground terminal 15 . The spaced shielding grooves 32 are in one-to-one correspondence with the spaced conductive ends 14, and the spaced shielding grooves 32 are opened just above the spaced conductive ends 14 to expose the upper end surface of the edge conductive ends 15, that is, the spaced shielding grooves 32 are filled with shielding After glueing, the shielding glue in the spaced shielding grooves 32 is connected to the spaced grounding end 14 , and the shielding glue in the spaced shielding groove 32 is connected to the conductive layer 12 in the substrate 1 through the spaced grounding end 14 .

[0048] In this embodiment, the common type shielding groove 31 is a rectangular groove. After the common type shielding groove 31 is filled with the shielding glue, the shielding glue layer in the common type shielding groove 31 is cut when the slicing is performed along the cutting path. It is divided into two parts and used as the common shielding adhesive layer of two adjacent Sip products respectively. In this embodiment, the slot width of the common type shielding slot 31 remains unchanged from the upper port to the lower port, and the slot width of the common type shielding slot 31 is the same as the width of the upper end face of the edge grounding end 15 . Make the shielding adhesive layer in the common type shielding groove 31 fully contact with the edge grounding terminal 15 .

[0049] In this embodiment, the spaced conductive ends 14 are of a T-shaped structure. The upper end surface of the horizontal portion of the T-shaped structure is flush with the upper surface of the substrate 1 , and the lower end surface of the vertical portion is connected to the conductive layer 12 . The slot width of the spaced shielding groove 32 gradually decreases from its upper port to the lower port, and the width of the lower port of the spaced shielding groove 32 is the same as the width of the upper end face of the spaced grounding end 14. When set in this way, the spaced shielding groove can be The shielding adhesive layer in 32 is in sufficient contact with the edge grounding terminal 15 , so that the shielding adhesive layer in the spaced shielding groove 32 can be connected to the conductive layer 12 in the substrate 1 through the edge grounding terminal 15 .

[0050] The SiP module to be coated with electromagnetic shielding glue disclosed in this embodiment can be provided with an intermediate shielding layer and a common type shielding layer at the same time, thereby effectively improving the unit output of the process of subsequently providing the electromagnetic shielding layer.

[0051] Of course, in other specific embodiments of the SiP module to be coated with electromagnetic shielding glue of the present invention, the common type shielding groove can also be set as a polygonal annular groove, a circular annular groove or other irregular-shaped grooves, but the grooves The shape of the body should not affect the filling of the shielding adhesive layer in the common shielding groove 31, and at the same time does not affect the formation of the common shielding adhesive layer of the Sip product after the split; the number and method of layout of electronic components can be adjusted according to needs; interval grounding The edge grounding terminal can also be set to a T-shaped structure; the specific structures of the spaced grounding terminal and the edge grounding terminal can be adjusted according to actual needs. It can also be adjusted according to actual needs, which will not be described in detail here.

Example Embodiment

Specific embodiment three

[0052] like image 3 As shown, this specific embodiment discloses an electromagnetic shielding glue coating device, which is used to implement the manufacturing method of the SiP module with the electromagnetic shielding structure in the specific embodiment 1, including a vacuum chamber 4, a dispensing head (not shown in the figure) shown) and the moving scraper 5, the vacuum chamber 4 provides a vacuum environment for the SiP module to be coated with electromagnetic shielding glue, so that the common type shielding groove 31 and the interval shielding groove 32 in the SiP module to be coated with electromagnetic shielding glue are are in a vacuum state, and the dispensing head is used to provide shielding glue 7 to the upper surface of the SiP module to be coated with electromagnetic shielding glue. The movable scraper 5 is located in the vacuum chamber 4. In the working state, the movable scraper 5 is located on the upper surface of the SiP module, and reciprocates along the upper surface of the plastic sealing layer 3 of the SiP module to complete the coating of the shielding glue. Specifically, the electromagnetic shielding glue coating device further includes a baffle 6, the baffle 6 is a frame-shaped structure, used to cover the edge of the upper surface of the plastic sealing layer 3 of the SiP module to be coated with electromagnetic shielding glue, and make a single The Sip module is exposed, so the setting can prevent the excess shielding glue from contaminating the surface of the plastic body, and it is also convenient to deal with the excess shielding glue.

[0053] In the specific implementation, a certain angle is formed between the moving scraper 5 and the upper surface of the Sip module when moving, so that the moving scraper 5 can apply pressure to the shielding glue on the Sip module. A slope can also be set at the bottom, so as to further facilitate the movement of the scraper 5 to apply pressure to the shielding glue.

[0054] When setting the shielding adhesive layer, since the Sip module to be provided with the electromagnetic shielding adhesive layer is located in the vacuum chamber 4, the grooves in the Sip module are all in a vacuum state, so that the moving scraper 5 moves horizontally above the Sip module , During the moving process, the shielding glue on the upper surface of the Sip module gradually fills the common shielding groove 31 and the interval shielding groove 32. Since the groove is in a vacuum state, the filling of the shielding glue is more sufficient, and the shielding glue is moving. A shielding adhesive layer 8 is formed on the upper surface of the Sip module under the action of the scraper 5 .

[0055] The device for disposing the electromagnetic shielding adhesive layer disclosed in this embodiment is simple in structure, small in occupied space, low in device cost, and simple in the manufacturing process, which can effectively increase the efficiency of the electromagnetic shielding adhesive layer manufacturing process of the Sip module, which is beneficial to the saving of adhesive materials. , reducing the production cost.

[0056] In other specific embodiments of the electromagnetic shielding adhesive coating device of the present invention, the specific structure of the baffle is adaptively adjusted according to the shape and size of the SiP module to be coated with electromagnetic shielding adhesive. Of course, the baffle may not be provided .

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Description & Claims & Application Information

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Classification and recommendation of technical efficacy words

Low production cost
Simple installation

Manufacturing method of Sip module with electromagnetic shielding structure and device

AI-Extracted Technical Summary

Problems solved by technology

Abstract

Image

Examples

Example Embodiment

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

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