Manufacturing method of Sip module with electromagnetic shielding structure and device
An electromagnetic shielding structure and electromagnetic shielding technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high integration of Sip, large shielding slot size, and high fixture cost, and achieve small occupied space and production cost. The effect of low and low production cost
Pending Publication Date: 2019-02-01
HUANWEI ELECTRONICS SHANGHAI CO LTD
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The present invention discloses a manufacturing method of Sip (System In a Package) module with an electromagnetic shielding structure and a device. An SiP module to be subjected to coating of electromagnetic shielding glue is manufactured, The SiP module comprises a substrate, a plurality of electronic elements and a plastic package layer, the substrate comprises a support layer, a conductive layer and an insulation layer, the insulation layer is internally provided with an interval conductive terminal and an edge conductive terminal, the lower end faces of the two conductive terminals are connected with a conductive layer, and the upper end faces of the two conductive terminals are in level in the upper end face of the substrate; the electronic element is welded at the upper surface of the substrate, and the electronic element having an anti-electromagnetic interference requirement is independently arranged at one side of the interval conductive terminal; the plastic package layer coats the electronic element; the plastic package layer is internally provided with an interval shielding groove and a conformal shielding groove cutting through the plastic package layer from top to bottom, and shielding glue fills in the interval shielding groove and the conformal shielding groove in a vacuum coating mode. The SiP module manufacturing method can allow the interval shielding layerand the conformal shielding layer at the same time, is simple in coating device, low in manufacturing cost and few in manufacturing process, can save the glue materials and can reduce the product cost.
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