Manufacturing method of Sip module with electromagnetic shielding structure and device

Abstract

The present invention discloses a manufacturing method of Sip (System In a Package) module with an electromagnetic shielding structure and a device. An SiP module to be subjected to coating of electromagnetic shielding glue is manufactured, The SiP module comprises a substrate, a plurality of electronic elements and a plastic package layer, the substrate comprises a support layer, a conductive layer and an insulation layer, the insulation layer is internally provided with an interval conductive terminal and an edge conductive terminal, the lower end faces of the two conductive terminals are connected with a conductive layer, and the upper end faces of the two conductive terminals are in level in the upper end face of the substrate; the electronic element is welded at the upper surface of the substrate, and the electronic element having an anti-electromagnetic interference requirement is independently arranged at one side of the interval conductive terminal; the plastic package layer coats the electronic element; the plastic package layer is internally provided with an interval shielding groove and a conformal shielding groove cutting through the plastic package layer from top to bottom, and shielding glue fills in the interval shielding groove and the conformal shielding groove in a vacuum coating mode. The SiP module manufacturing method can allow the interval shielding layerand the conformal shielding layer at the same time, is simple in coating device, low in manufacturing cost and few in manufacturing process, can save the glue materials and can reduce the product cost.

Description

technical field [0001] The invention relates to the improvement of Sip packaging (System In a Package system-level packaging) process technology, in particular to a manufacturing method and device of a Sip module with an electromagnetic shielding structure. Background technique [0002] SIP packaging (System In a Package) integrates multiple functional chips, including processors, memory and other functional chips, into one package to achieve a basically complete function. In order to prevent the internal signals of electronic products from being interfered or interfere with each other, resulting in a decrease in the communication quality, it is generally necessary to set an intermediate shielding layer in the electronic product to isolate electronic components with different functions, and the outermost layer of the electronic product is provided with a common type shielding layer, and the intermediate shielding layer Both the shielding layer and the common type shielding l...

AI Technical Summary

Problems solved by technology

When the existing intermediate shielding layer is installed, it is generally first to open a groove on the adhesive layer on the substrate, and fill the groove with liquid shielding glue by spraying, so as to form the electromagnetic shielding in the Sip product. This process In the method, the size of the shielding groove is large, the UPH (Unit Per Hour, output per hour) is low, and the waste of glue is relatively large, which cannot meet the needs of high integration and low cost of Sip products.

However, the existing conformal shielding uses sputtering coating to coat a layer of shielding film on the outer surface of a single Sip after cutting. This kind of process equipment and fixtures are expensive.

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