Manufacturing method of Sip module with electromagnetic shielding structure and device
An electromagnetic shielding structure and electromagnetic shielding technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high integration of Sip, large shielding slot size, and high fixture cost, and achieve small occupied space and production cost. The effect of low and low production cost
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Specific embodiment one
[0035] combine Figures 1 to 5As shown, this specific embodiment discloses a manufacturing method of a SiP module with an electromagnetic shielding structure, comprising the steps of:
[0036] S1, make the substrate 1, such as figure 1 As shown, the substrate 1 includes a support layer 11, a conductive layer 12 and an insulating layer 13 that are stacked in sequence from bottom to top. The substrate 1 is preset with a number of single SiP module layout areas and cutting for separating the single SiP modules. In the insulating layer 13, a spaced conductive end 14 is arranged in the layout area of a single SiP module, in the insulating layer 13, an edge conductive end 15 is provided on the cutting track, and the lower end faces of the spaced conductive end 14 and the edge conductive end 15 are respectively The conductive layers 12 are connected, and the upper end surfaces of the spaced conductive ends 14 and the edge conductive ends 15 are exposed on...
Example Embodiment
Specific embodiment two
[0046] combine figure 1 , 2 As shown, this specific embodiment discloses a SiP module to be coated with electromagnetic shielding glue, including a substrate 1, a plurality of electronic components and a plastic sealing layer 3. The substrate 1 includes a supporting layer 11, The conductive layer 12 and the insulating layer 13 are preset on the substrate 1 with a number of single SiP module layout areas and dicing lanes used to separate the single SiP modules. In the insulating layer 13, the single SiP module layout area is arranged with a spaced conductive layer. End 14, the edge conductive end 15 is arranged in the insulating layer 13 and on the cutting track, the lower end surfaces of the spaced conductive end 14 and the edge conductive end 15 are respectively connected to the conductive layer 12, and the upper end surface of the spaced conductive end 14 and the edge conductive end 15 is connected to the substrate The upper end surface of 1 is flu...
Example Embodiment
Specific embodiment three
[0052] like image 3 As shown, this specific embodiment discloses an electromagnetic shielding glue coating device, which is used to implement the manufacturing method of the SiP module with the electromagnetic shielding structure in the specific embodiment 1, including a vacuum chamber 4, a dispensing head (not shown in the figure) shown) and the moving scraper 5, the vacuum chamber 4 provides a vacuum environment for the SiP module to be coated with electromagnetic shielding glue, so that the common type shielding groove 31 and the interval shielding groove 32 in the SiP module to be coated with electromagnetic shielding glue are are in a vacuum state, and the dispensing head is used to provide shielding glue 7 to the upper surface of the SiP module to be coated with electromagnetic shielding glue. The movable scraper 5 is located in the vacuum chamber 4. In the working state, the movable scraper 5 is located on the upper surface of the SiP module...
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