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Preparation method of high-heat-conduction condensed ring polyimide film

A technology of polyimide film and high thermal conductivity, which is applied in the field of film preparation, can solve problems such as the decline of mechanical properties, achieve excellent mechanical properties, and improve the effect of thermal conductivity

Active Publication Date: 2019-02-15
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the formation of thermal network chains means adding a large amount of thermally conductive fillers, which will inevitably cause the problem of mechanical property degradation.

Method used

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  • Preparation method of high-heat-conduction condensed ring polyimide film
  • Preparation method of high-heat-conduction condensed ring polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for preparing a high thermal conductivity fused-ring polyimide film, comprising the following steps:

[0024] S1. In a reactor filled with nitrogen at 15°C, dissolve 15.820g (0.1mol) of 1,4-diaminonaphthalene in 241g of N,N-dimethylformamide (DMF), and then dissolve the 24.136g (0.090mol), 2.414g (0.009mol), 0.134g (0.0005mol) of 1,4,5,8-naphthalene tetracarboxylic dianhydride were added to it and stirred for reaction, the reaction time after each addition of fused ring dianhydride for 30min. A polyamic acid solution with a solid content of 15% and a viscosity of 1000 poise was obtained.

[0025] S2. Add 2.125 g of nano-alumina (average particle size: 30 nm) to the polyamic acid solution, disperse it uniformly with an ultrasonic disperser to obtain a mixed solution, and vacuum defoam.

[0026] S3. After coating the mixed solution on the mirror steel plate, place it in a forced air drying oven, and dry it at 140° C. for 20 minutes. Peel off the obtained gel f...

Embodiment 2

[0028] A method for preparing a high thermal conductivity fused-ring polyimide film, comprising the following steps:

[0029] S1. In a reactor filled with nitrogen at 20°C, dissolve 23.824g (0.1mol) of 2,6-diaminoanthraquinone in 287g of N,N-dimethylacetamide (DMAC), and then divide it into three separate Add 35.310g (0.090mol), 3.531g (0.009mol), 0.392g (0.001mol) of perylene-3,4,9,10-tetracarboxylic dianhydride into it and stir the reaction, adding fused ring di The reaction time after anhydride was 30min. A polyamic acid solution with a solid content of 15% and a viscosity of 1750 poise was obtained.

[0030] S2. Add 6.306g of nano-magnesia (average particle size: 30nm) to the polyamic acid solution, disperse it uniformly with an ultrasonic disperser to obtain a mixed solution, and vacuum defoam.

[0031] S3. After coating the mixed solution on the mirror steel plate, place it in a blast drying oven, and dry it at 150° C. for 15 minutes. Peel off the obtained gel film, f...

Embodiment 3

[0033] A method for preparing a high thermal conductivity fused-ring polyimide film, comprising the following steps:

[0034] S1. In a reactor filled with nitrogen at 25°C, 4.746g (0.03mol) of 1,4-diaminonaphthalene, 4.746g (0.03mol) of 1,5-diaminonaphthalene and 9.530g (0.04mol) of 2 , 6-diaminoanthraquinone was dissolved in 184g of N,N-dimethylformamide (DMF), and then 24.136g (0.090mol) of 1,4,5,8-naphthalene tetracarboxylic dianhydride , 2.682g (0.010mol) of 1,4,5,8-naphthalene tetracarboxylic dianhydride, 0.196g (0.0005mol) of perylene-3,4,9,10-tetracarboxylic dianhydride were added and stirred for reaction , The reaction time for each addition of condensed dianhydride is 30min. A polyamic acid solution with a solid content of 20% and a viscosity of 2200 poise was obtained.

[0035] S2. Add 9.207g of nanometer boron nitride (average particle size: 30nm) to the polyamic acid solution, disperse it uniformly with an ultrasonic disperser to obtain a mixed solution, and vacu...

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Abstract

The invention discloses a preparation method of a high-heat-conduction condensed ring polyimide film. The preparation method of the high-heat-conduction condensed ring polyimide film comprises the following steps: reacting condensed ring diamine and condensed ring dianhydride in an aprotic polar solvent in a nitrogen environment according to the molar ratio of 1: 0.995-1.005 to obtain a polyamideacid solution; adding nano heat-conduction packing in the polyamide acid solution, and dispersing the polyamide acid solution uniformly by using an ultrasonic dispersion instrument to obtain a mixed solution, wherein the nano heat-conduction packing accounts for 5%-20wt% of the total amounts of the condensed ring diamine and the condensed ring dianhydride; coating a mirror-surface steel plate withthe mixed solution, and drying and stripping to obtain a gel film; fixing the periphery of the gel film on a metal frame, and carrying out imidization on the gel film in an imidization furnace to obtain the high-heat-conduction condensed ring polyimide film. The heat conduction coefficient of the prepared high-heat-conduction condensed ring polyimide film reaches up to 1.8-6.0 W-m<-1>k<-1>, and meanwhile, the high-heat-conduction condensed ring polyimide film has properties of high strength, high modulus and the like.

Description

technical field [0001] The invention relates to the technical field of film preparation, in particular to a preparation method of a highly thermally conductive fused-ring polyimide film. Background technique [0002] Polyimide film is a kind of film insulation material with the best performance. It also has excellent heat resistance and mechanical properties. It has been widely used in flexible printed circuit substrates, microelectronic integrated circuits and special electrical appliances. . [0003] As all kinds of electronic products are becoming more and more miniaturized, microelectronics are operating at high speed and high density, resulting in a large amount of heat generated by integrated circuits and electronic components. If they cannot be channeled in time, it will affect electronic components. normal operation, and even security issues. However, the thermal conductivity of ordinary polyimide film is only 0.16W·m -1 k -1 , limiting its application in the fie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10C08K3/38C08K3/22C08L79/08
CPCC08G73/1007C08G73/1067C08J5/18C08J2379/08C08K3/22C08K3/38C08K2003/222C08K2003/2227C08K2003/385C08K2201/003C08K2201/011
Inventor 史恩台
Owner ANHUI GUOFENG PLASTIC