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High-temperature-resistant heat dissipation substrate and preparation method thereof

A heat-dissipating substrate, high temperature resistant technology, applied in non-polymer adhesive additives, film/flake adhesives, adhesive additives, etc., can solve the problem of poor bonding performance and low glass transition temperature of adhesives , heat dissipation substrate heat resistance, poor weather resistance and other problems, to achieve the effect of low cost, reduced equipment and raw material costs, excellent long-term reliability

Inactive Publication Date: 2019-02-19
江西华莲欣科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high temperature resistant heat dissipation substrate, which has solved the problems of poor heat resistance and weather resistance of the above heat dissipation substrate, and the low glass transition temperature and poor bonding performance of the adhesive on the heat dissipation plate

Method used

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  • High-temperature-resistant heat dissipation substrate and preparation method thereof
  • High-temperature-resistant heat dissipation substrate and preparation method thereof
  • High-temperature-resistant heat dissipation substrate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0040] A high temperature heat dissipation substrate, including adhesive and copper foil, the adhesive contains the following components:

[0041] Self-made polyimide resin: 20 parts; Aluminum oxide: 8 parts; The preparation method of described self-made polyimide resin is as follows:

[0042] (1) Add glue-free mother liquor, p-phenylenediamine, 2,2-bis[4-(4-aminophenoxy)phenyl]propane and dimethylacetamide into the reaction kettle and mix and stir until dissolved; In terms of parts, the number of parts of the glue-free mother liquor is 80 to 90 parts, the number of parts of the p-phenylenediamine is 10 to 20 parts, and the number of parts of the 2,2-bis[4-(4-aminophenoxy ) The number of parts of phenyl]propane is 3 to 5 parts, and the number of parts of the dimethylacetamide is 250 to 270 parts;

[0043] (2) Slowly add 15 parts of benzophenone tetraacid dianhydride, and continue to stir the solution;

[0044] (3) Add 100 parts of 2,3,3',4'-biphenyltetracarboxylic dianhydride ...

Embodiment 2

[0050] Embodiment 2: Homemade polyimide resin: 20 parts; Aluminum oxide: 10 parts

[0051] Preparation method is with embodiment one;

Embodiment 3

[0052] Embodiment three: homemade polyimide resin: 20 parts; Aluminum oxide: 12 parts

[0053] Preparation method is with embodiment one;

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Abstract

The invention discloses a high-temperature-resistant heat dissipation substrate. The substrate comprises a copper foil and an adhesive and is characterized in that the adhesive is prepared from, by mass, 18-22 parts of self-made polyimide resin and 8-16 parts of aluminum oxide. The invention further discloses a self-made polyimide resin and high-temperature-resistant heat dissipation substrate preparation method. The high-temperature-resistant heat dissipation substrate prepared according to the method is high in heat resistance and weather resistance, production cost is greatly reduced, and apromising development prospect is achieved.

Description

technical field [0001] The invention relates to the field of heat dissipation substrates, in particular to a high temperature resistant heat dissipation substrate and a preparation method thereof. Background technique [0002] High temperature resistant heat dissipation substrate (high temperature resistant heat dissipation substrate) mainly refers to a high temperature resistant heat dissipation substrate made of high temperature resistant polyimide (PI) as the insulating base film. Compared with the traditional rigid high temperature heat dissipation substrate The substrate, which has the characteristics of lightness, thinness, small size, flexibility and three-dimensional wiring, is widely favored. Printed circuit boards made of high temperature heat dissipation substrates have been widely used in mobile phones, digital cameras, digital video cameras, notebook computers and other portable electronic equipment, as well as flat-panel TVs, office automation equipment, automo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/28C09J179/08C09J11/04C08G73/10
CPCC09J7/28C08G73/1042C08G73/1067C08K2003/2227C09J11/04C09J179/08C09J2400/163C08K3/22
Inventor 杨侨华周志峰桑俊俸廖礼洪吴永红
Owner 江西华莲欣科技有限公司