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Conductive copper paste with silver-coated copper and method for preparing conductive copper paste

A technology of silver-coated copper and copper paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. The problems of high impurity content of copper conductive copper paste, increased production cost and production difficulty, etc., achieve the effects of convenient acquisition, low cost of raw materials and processing, and simple processing and production technology.

Active Publication Date: 2019-02-19
焦作市高森建电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Silver-coated copper conductive copper paste is widely used in the production and processing of electronic equipment such as circuit boards. It plays a vital role. At present, in the production and preparation of silver-coated copper conductive copper paste, the production technology used is often traditional technology. Although it can meet the production needs, it often needs to use a large amount of polymer organic matter, Raw materials such as heavy metal ions not only increase the production cost and difficulty of production, but also cause great environmental pollution. In addition, it is also very easy to lead to high impurity content in the silver-coated copper conductive copper paste, which seriously affects the quality of the silver-coated copper. The stability and reliability of the conductivity and corrosion resistance of copper conductive copper paste products, so in view of this situation, there is an urgent need for a new silver-coated copper conductive copper paste and its preparation method to meet the needs of actual use

Method used

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  • Conductive copper paste with silver-coated copper and method for preparing conductive copper paste

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Experimental program
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Effect test

Embodiment 1

[0017] A silver-coated copper conductive copper paste, which is composed of the following substances in mass percentage: 10% trimethylolpropane trimethacrylate, 20% N-vinylpyrrolidone, 6% tert-butyl perbenzoate, alkylphenol poly 10% oxyethylene ether, 21% silver-coated copper powder, 1% fumed silica, 25% pentanol, 5% coupling agent, and the balance is epoxy acrylic resin.

[0018] Wherein, the particle size of the silver-clad copper powder is not greater than 1 micron.

[0019] A preparation method of silver-clad copper conductive copper paste, comprising the following steps:

[0020] S1, base material mixing, in a constant temperature environment of 20°C, mix trimethylolpropane trimethacrylate and N-vinylpyrrolidone, and stir at a constant speed and one direction at a speed of 100 rpm for 3 minutes, and then the gas phase White carbon black is added to the mixture, and stirred at a uniform speed of 2000 rpm for 30 minutes, then epoxy acrylic resin is added to the mixture, an...

Embodiment 2

[0027] A silver-coated copper conductive copper paste is composed of the following substances in mass percentage: 15% trimethylolpropane trimethacrylate, 15% N-vinylpyrrolidone, 3% tert-butyl perbenzoate, alkylphenol poly Oxyethylene ether 7%, silver-coated copper powder 16%, fumed silica 0.05%, pentanol 11%, coupling agent 2%, and the balance is epoxy acrylic resin.

[0028] Wherein, the particle size of the silver-clad copper powder is not greater than 1 micron.

[0029] A preparation method of silver-clad copper conductive copper paste, comprising the following steps:

[0030] S1, base material mixing, in a constant temperature environment of 40°C, mix trimethylolpropane trimethacrylate and N-vinylpyrrolidone, and stir at a constant speed and one direction at a speed of 300 rpm for 5 minutes, and then the gas phase White carbon black is added to the mixture, and stirred at a constant speed of 2000 rpm for 30 minutes, then epoxy acrylic resin is added to the mixture, and st...

Embodiment 3

[0037] A silver-coated copper conductive copper paste, which is composed of the following substances in mass percentage: 12% trimethylolpropane trimethacrylate, 18% N-vinylpyrrolidone, 4% tert-butyl perbenzoate, alkylphenol poly Oxyethylene ether 8%, silver-coated copper powder 18%, fumed silica 0.5%, pentanol 15%, coupling agent 4%, and the balance is epoxy acrylic resin.

[0038] Wherein, the particle size of the silver-clad copper powder is not greater than 1 micron.

[0039] A preparation method of silver-clad copper conductive copper paste, comprising the following steps:

[0040] S1, base material mixing, in a constant temperature environment of 30°C, mix trimethylolpropane trimethacrylate and N-vinylpyrrolidone, and stir at a constant speed and one direction at a speed of 200 rpm for 4 minutes, and then the gas phase White carbon black is added to the mixture, and stirred at a uniform speed of 2000 rpm for 30 minutes, then epoxy acrylic resin is added to the mixture, a...

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Abstract

The invention relates to conductive copper paste with silver-coated copper. The conductive copper paste comprises, by weight, 10%-15% of trimethylolpropane trimethyl acrylate, 15%-20% of N-vinyl pyrrolidone, 3%-6% of tert-butyl perbenzo, 7%-10% of alkylphenol ethoxylates, 16%-21% OF silver-coated copper powder, 0.05%-1% of fumed silica, 11%-25% of mixed pentanol, 2%-5% of coupling agents and the balance epoxy acrylic resin. A method for preparing the conductive copper paste includes three steps of mixing base materials with one another; modifying the base materials; mixing copper powder and the like. The conductive copper paste and the method have the advantages that raw materials for the conductive copper paste can be conveniently and quickly acquired, and the conductive copper paste is low in raw material and processing cost and few in toxic and side effect; technologies for processing and producing the conductive copper paste are simple, accordingly, the production efficiency of theconductive copper paste with the silver-coated copper can be effectively improved, the production cost can be reduced, and the electric conductivity, the adhesion and the corrosion resistance of theconductive copper paste with the silver-coated copper can be effectively improved.

Description

technical field [0001] The invention relates to a silver-clad copper conductive copper paste and a preparation method thereof, belonging to the technical field of production of aluminum-based copper-clad laminates. Background technique [0002] Silver-coated copper conductive copper paste is widely used in the production and processing of electronic equipment such as circuit boards. It plays a vital role. At present, in the production and preparation of silver-coated copper conductive copper paste, the production technology used is often traditional technology. Although it can meet the production needs, it often needs to use a large amount of polymer organic matter, Raw materials such as heavy metal ions not only increase the production cost and difficulty of production, but also cause great environmental pollution. In addition, it is also very easy to lead to high impurity content in the silver-coated copper conductive copper paste, which seriously affects the quality of th...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 辛凤高辛得才
Owner 焦作市高森建电子科技有限公司