Conductive copper paste with silver-coated copper and method for preparing conductive copper paste
A technology of silver-coated copper and copper paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. The problems of high impurity content of copper conductive copper paste, increased production cost and production difficulty, etc., achieve the effects of convenient acquisition, low cost of raw materials and processing, and simple processing and production technology.
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Embodiment 1
[0017] A silver-coated copper conductive copper paste, which is composed of the following substances in mass percentage: 10% trimethylolpropane trimethacrylate, 20% N-vinylpyrrolidone, 6% tert-butyl perbenzoate, alkylphenol poly 10% oxyethylene ether, 21% silver-coated copper powder, 1% fumed silica, 25% pentanol, 5% coupling agent, and the balance is epoxy acrylic resin.
[0018] Wherein, the particle size of the silver-clad copper powder is not greater than 1 micron.
[0019] A preparation method of silver-clad copper conductive copper paste, comprising the following steps:
[0020] S1, base material mixing, in a constant temperature environment of 20°C, mix trimethylolpropane trimethacrylate and N-vinylpyrrolidone, and stir at a constant speed and one direction at a speed of 100 rpm for 3 minutes, and then the gas phase White carbon black is added to the mixture, and stirred at a uniform speed of 2000 rpm for 30 minutes, then epoxy acrylic resin is added to the mixture, an...
Embodiment 2
[0027] A silver-coated copper conductive copper paste is composed of the following substances in mass percentage: 15% trimethylolpropane trimethacrylate, 15% N-vinylpyrrolidone, 3% tert-butyl perbenzoate, alkylphenol poly Oxyethylene ether 7%, silver-coated copper powder 16%, fumed silica 0.05%, pentanol 11%, coupling agent 2%, and the balance is epoxy acrylic resin.
[0028] Wherein, the particle size of the silver-clad copper powder is not greater than 1 micron.
[0029] A preparation method of silver-clad copper conductive copper paste, comprising the following steps:
[0030] S1, base material mixing, in a constant temperature environment of 40°C, mix trimethylolpropane trimethacrylate and N-vinylpyrrolidone, and stir at a constant speed and one direction at a speed of 300 rpm for 5 minutes, and then the gas phase White carbon black is added to the mixture, and stirred at a constant speed of 2000 rpm for 30 minutes, then epoxy acrylic resin is added to the mixture, and st...
Embodiment 3
[0037] A silver-coated copper conductive copper paste, which is composed of the following substances in mass percentage: 12% trimethylolpropane trimethacrylate, 18% N-vinylpyrrolidone, 4% tert-butyl perbenzoate, alkylphenol poly Oxyethylene ether 8%, silver-coated copper powder 18%, fumed silica 0.5%, pentanol 15%, coupling agent 4%, and the balance is epoxy acrylic resin.
[0038] Wherein, the particle size of the silver-clad copper powder is not greater than 1 micron.
[0039] A preparation method of silver-clad copper conductive copper paste, comprising the following steps:
[0040] S1, base material mixing, in a constant temperature environment of 30°C, mix trimethylolpropane trimethacrylate and N-vinylpyrrolidone, and stir at a constant speed and one direction at a speed of 200 rpm for 4 minutes, and then the gas phase White carbon black is added to the mixture, and stirred at a uniform speed of 2000 rpm for 30 minutes, then epoxy acrylic resin is added to the mixture, a...
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