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Method for preparing high-concentration nano-silver particle conductive ink through two-step method and conductive ink

A technology of nano-silver particles and conductive ink, which is applied in inks, household utensils, applications, etc., can solve the problems of complex nano-silver conductive ink technology, save preparation time and cost, improve preparation efficiency, and reduce process steps.

Inactive Publication Date: 2019-02-22
JIAXING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method for preparing nano-silver conductive ink has the disadvantage of complicated process

Method used

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  • Method for preparing high-concentration nano-silver particle conductive ink through two-step method and conductive ink
  • Method for preparing high-concentration nano-silver particle conductive ink through two-step method and conductive ink
  • Method for preparing high-concentration nano-silver particle conductive ink through two-step method and conductive ink

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Embodiment 1

[0022] (1) Dissolve 1.37 g of silver nitrate and 1.07 g of polyvinylpyrrolidone (PVP) in 40 ml of ethylene glycol, stir until a transparent solution; put the solution into a household microwave oven and heat it for 90 s; cool the reaction solution to room temperature , you can get nano-silver particle conductive ink. The morphology of the conductive components in the ink is as follows figure 1 Shown, wherein the average particle size of nano-silver particles is 107nm.

[0023] (2) Put the above ink into a syringe, control the ink flow rate through a syringe pump, use Epson photo paper as the base, and perform direct writing on a two-dimensional stepping platform, and put the photo paper into an oven to dry; dry The subsequent samples were hot-pressed and sintered at 100 °C and 10 MPa for 10 min. The morphology of the samples after sintering is shown in figure 2 , put it into the thin film thermoelectric test system (MRS-3M) to measure its resistivity, and the average resis...

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Abstract

The invention discloses a method for preparing high-concentration nano-silver particle conductive ink through a two-step method and the conductive ink. The method comprises the following steps: (1) completely dissolving 1 part by mass of silver nitrate in 30 parts by mass of glycol, and completely dissolving 1 part by mass of polyvinylpyrrolidone in a glycol solution, so as to prepare a conductiveink precursor; and (2) carrying out microwave heating on the glycol solution containing silver nitrate and polyvinylpyrrolidone for 90 seconds, cooling the heated mixed liquid to the room temperature, carrying out centrifugal concentration, and removing supernate, so as to obtain the conductive ink containing high-concentration nano-silver particles. The preparation steps in a traditional three-step method are replaced with the two steps of microwave heating and centrifugal concentration for preparing the conductive ink, so that the process steps are reduced, the preparation time and cost aresaved, and the preparation efficiency is improved; and a nano-silver lead prepared by virtue of the method preserves good electrical properties, and the preparation efficiency of the conductive ink is improved.

Description

technical field [0001] The invention relates to the technical field of printed electronics, in particular to a two-step method for preparing conductive ink with high-concentration nano-silver particles and the conductive ink. Background technique [0002] Printed electronics is a method of preparing various electronic components and devices by printing. It is a "non-contact" process. Taking the printed circuit board (PCB) as an example, compared with the traditional etching process, the printing process avoids the use of high-pollution methods such as electroplating and etching, so the technology itself has the advantage of being environmentally friendly. At present, printed electronics have been applied in aspects such as transparent electrodes, radio frequency identification, thin film transistors, light emitting diodes, solar cells, photovoltaics and so on. In addition, when using printing technology to prepare electronic components, flexible substrates such as paper and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/52
CPCC09D11/52
Inventor 汤成莉郑书虎邢博鹿业波黄风立左春柽
Owner JIAXING UNIV
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