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Photosensitive resin composition for photo-curing 3D printing and application thereof

A 3D printing, photosensitive resin technology, applied in the field of 3D printing, can solve the problem of the molecular structure requirements of the photosensitive resin composition and the difficulty in obtaining high-quality casting products.

Active Publication Date: 2019-03-01
HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from practical applications, it is difficult to obtain better quality casting products from products formed by simple photosensitive resin compositions.
WO9001727A1 proposes adding a thermoplastic material to improve the expansion during firing, but does not require the molecular structure of the photosensitive resin composition

Method used

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  • Photosensitive resin composition for photo-curing 3D printing and application thereof
  • Photosensitive resin composition for photo-curing 3D printing and application thereof
  • Photosensitive resin composition for photo-curing 3D printing and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A photocurable 3D printing photosensitive resin composition that can be used for investment casting, comprising 5wt% ethoxylated trimethylolpropane triacrylate, 15wt% ethoxylated bisphenol A diacrylate, and 50wt% aliphatic urethane acrylate ( The functionality is 3), 20wt% glycerol stearate, 10wt% TEPO (2,4,6-trimethylbenzoyl-ethoxy-phenyl phosphorous oxide).

[0035] The manufacturing process of the composition is as follows: after 1 hour of stirring in an emulsifier, vacuum defoaming treatment.

[0036] The liquid composition has a wavelength of 405nm and an energy value of 6500uW / cm 2 After the surface of each layer with a printing time of 3s under the light source is exposed and molded, after cleaning, the baking residue rate is less than 0.5wt%.

Embodiment 2

[0038] A photocurable 3D printing photosensitive resin composition that can be used for investment casting, comprising 50wt% ethoxylated pentaerythritol triacrylate, 21wt% polyethylene glycol (200) acrylate, 23.5wt% aliphatic polyurethane acrylate (functional The degree is 2), 5wt% polyethylene wax powder, 0.5wt% TPO (2,4,6-trimethylbenzoyl-diphenylphosphorus oxide).

[0039] The manufacturing process of the composition is as follows: after 1 hour of stirring in an emulsifier, vacuum defoaming treatment.

[0040] The liquid composition has a wavelength of 405nm and an energy value of 6500uW / cm 2 After the surface of each layer with a printing time of 4s under the light source is exposed and formed, after cleaning, the baking residue rate is less than 0.5 wt%.

Embodiment 3

[0042] A photocurable 3D printing photosensitive resin composition that can be used for investment casting, comprising 10wt% ethoxylated pentaerythritol acrylate, 80wt% polyethylene glycol (1000) acrylate, 9wt% polyester polyol, 1wt% 819[ (Bis(2,4,6-trimethylbenzoylphenyl)phosphorus oxide)].

[0043] The manufacturing process of the composition is as follows: after 2 hours of stirring in an emulsifier, vacuum defoaming treatment.

[0044] The liquid composition has a wavelength of 405nm and an energy value of 6500uW / cm 2 After the surface under the light source with a printing time of 5s is exposed and formed, after cleaning, the baking residue rate is less than 0.5wt%.

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PUM

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Abstract

The invention provides a photosensitive resin composition for photo-curing 3D printing, which includes, by weight, 5-50% of a first mixture including ethoxylated trimethylolpropane triacrylate and ethoxylated pentaerythritol acrylate, 15-80% of a second mixture including ethoxylated bisphenol A diacrylate and polyethylene glycol acrylate, and 5-75% of a thermoplastic material and 0.5-10% of a freeradical initiator. Compared with the prior art, by combining the photosensitive resin, in special structure, with the thermoplastic material, the resin product is low in roasting residual rate and expansion rate. By means of roasting pour casting, a casting product having good surface quality is produced. The invention also provides an application of the photosensitive resin composition to photo-curing 3D printing.

Description

Technical field [0001] The invention relates to the technical field of 3D printing, in particular to a photosensitive resin composition for light-curing 3D printing and its application. Background technique [0002] Compared with the traditional lost wax mold casting, the investment casting technology produced by the combination of light curing molding and investment casting technology has the advantages of simple process flow and design of complex shape products. The material model prepared by light-curing 3D printing is a thermosetting resin, which cannot melt and flow after being heated, and can only be softened first. There is a large thermal expansion and deformation during the combustion and gasification process, which is 1-2 orders of magnitude larger than the deformation of the shell material , So it is easy to cause the shell to burst. In addition, with certain resin outgassing and a small amount of residue, it is easy to reduce the quality of castings. [0003] Kang Xia...

Claims

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Application Information

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IPC IPC(8): C08F283/06C08F283/00C08F222/20C08L51/08C08L23/06C08L91/06C08K5/12C08K5/09B33Y70/00
CPCC08F283/008C08F283/065C08L51/08B33Y70/00C08L23/06C08L91/06C08K5/12C08K5/09C08F222/1025C08F222/104C08F222/103
Inventor 刘丹丹来国桥陈遒胡自强张小敏
Owner HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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