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A kind of photosensitive resin composition and application thereof for photocuring 3D printing

A 3D printing, photosensitive resin technology, applied in the field of 3D printing, can solve the molecular structure requirements of the photosensitive resin composition, and it is difficult to obtain high-quality casting products, etc.

Active Publication Date: 2021-05-04
HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from practical applications, it is difficult to obtain better quality casting products from products formed by simple photosensitive resin compositions.
WO9001727A1 proposes adding a thermoplastic material to improve the expansion during firing, but does not require the molecular structure of the photosensitive resin composition

Method used

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  • A kind of photosensitive resin composition and application thereof for photocuring 3D printing
  • A kind of photosensitive resin composition and application thereof for photocuring 3D printing
  • A kind of photosensitive resin composition and application thereof for photocuring 3D printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A photocurable 3D printing photosensitive resin composition that can be used for investment casting, comprising 5wt% ethoxylated trimethylolpropane triacrylate, 15wt% ethoxylated bisphenol A diacrylate, 50wt% aliphatic urethane acrylate ( Functionality 3), 20 wt% glyceryl stearate, 10 wt% TEPO (2,4,6-trimethylbenzoyl-ethoxy-phenylphosphine oxide).

[0035] The manufacturing process of the composition is as follows: after being stirred by an emulsifier for 1 hour, vacuum defoaming treatment is carried out.

[0036] The liquid composition has a wavelength of 405nm and an energy value of 6500uW / cm 2 After the surface exposure and molding of each layer with a printing time of 3s under the light source, after cleaning, the baking residual rate is less than 0.5wt%.

Embodiment 2

[0038] A photocurable 3D printing photosensitive resin composition that can be used for investment casting, comprising 50wt% ethoxylated pentaerythritol triacrylate, 21wt% polyethylene glycol (200) acrylate, 23.5wt% aliphatic urethane acrylate (functional Degree 2), 5wt% polyethylene wax powder, 0.5wt% TPO (2,4,6-trimethylbenzoyl-diphenylphosphine oxide).

[0039] The manufacturing process of the composition is as follows: after being stirred by an emulsifier for 1 hour, vacuum defoaming treatment is carried out.

[0040] The liquid composition has a wavelength of 405nm and an energy value of 6500uW / cm 2 After the surface exposure and molding of each layer with a printing time of 4s under the light source, after cleaning, the baking residual rate is less than 0.5wt%.

Embodiment 3

[0042] A photocurable 3D printing photosensitive resin composition that can be used for investment casting, comprising 10wt% ethoxylated pentaerythritol acrylate, 80wt% polyethylene glycol (1000) acrylate, 9wt% polyester polyol, 1wt% 819[ (bis(2,4,6-trimethylbenzoylphenyl)phosphorus oxide)].

[0043] The manufacturing process of the composition is as follows: after being stirred by an emulsifier for 2 hours, vacuum defoaming treatment is performed.

[0044] The liquid composition has a wavelength of 405nm and an energy value of 6500uW / cm 2 After the surface exposure and molding of each layer with a printing time of 5s under the light source, after cleaning, the baking residual rate is less than 0.5wt%.

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Abstract

The invention provides a photosensitive resin composition for photocuring 3D printing, which comprises the following components by weight percentage: 5-50% of the first mixture; 15-80% of the second mixture; 5-75% of thermoplastic material; free radical initiation 0.5-10%; the first mixture includes ethoxylated trimethylolpropane triacrylate and ethoxylated pentaerythritol acrylate, and the second mixture includes ethoxylated bisphenol A diacrylate and polyethylene glycol acrylate . Compared with the prior art, the present invention combines photosensitive resin with special structure and thermoplastic material to obtain resin products with low roasting residual rate and low expansion, and can obtain casting products with good surface quality after roasting and pouring. The present invention also provides an application of the photosensitive resin composition for photocurable 3D printing described in the above technical solution in a photocurable 3D printer.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a photosensitive resin composition for photocuring 3D printing and its application. Background technique [0002] Compared with the traditional lost wax casting, the investment casting technology produced by the combination of light curing molding and investment casting technology has the advantages of simple process flow and the ability to design complex shape products. The material model prepared by light-curing 3D printing is a thermosetting resin, which cannot melt and flow after being heated, but can only be softened first, and has a large thermal expansion deformation during the combustion and gasification disappearance process, which is 1-2 orders of magnitude larger than the deformation of the shell material , so it is easy to cause the shell to burst. In addition, it is accompanied by a certain amount of resin outgassing and a small amount of residue, which easily r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/06C08F283/00C08F222/20C08L51/08C08L23/06C08L91/06C08K5/12C08K5/09C08K5/103B33Y70/00B33Y70/10
CPCC08F283/008C08F283/065C08L51/08B33Y70/00C08L23/06C08L91/06C08K5/12C08K5/09C08F222/1025C08F222/104C08F222/103
Inventor 刘丹丹来国桥陈遒胡自强张小敏
Owner HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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