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Photosensitive resin composition, photosensitive resin and electronic device

A technology of photosensitive resin and composition, applied in the field of photosensitive resin and electronic device, photosensitive resin composition, can solve the problems of detracting the service life of electronic device, poor adhesion, falling off, etc.

Active Publication Date: 2022-04-05
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The properties of photosensitive resin are related to the quality of electronic devices (such as OLED display components). For example, when photosensitive resin is used in electronic devices, it often needs to be bonded with other components. If the adhesion of photosensitive resin is not good, it is easy to fall off and cause Reduced service life of electronic devices

Method used

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  • Photosensitive resin composition, photosensitive resin and electronic device
  • Photosensitive resin composition, photosensitive resin and electronic device
  • Photosensitive resin composition, photosensitive resin and electronic device

Examples

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preparation example Construction

[0048]

[0049] The preparation method of the polymer includes the following steps: providing diamine compound, other monomers and monoamine compound as reactants, and carrying out polymerization reaction in an organic solvent to obtain a reaction solution containing the polymer. And can selectively carry out dehydration dead cycle reaction.

[0050] The aforementioned organic solvents are used to dissolve the reactant monomers and product polymers, and can be classified into organic solvents with better solubility and organic solvents with poorer solubility according to the solubility of the organic solvent to the polymer.

[0051] Organic solvents with better solubility can be, but not limited to, N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylcaprolactam, dimethyl sulfoxide, tetra Methyl urea, hexamethylphosphoramide, γ-butyrolactone or pyridine, the above organic solvents can be used alone or in combination of two or more.

[0052] Organic so...

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PUM

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Abstract

The invention relates to a photosensitive resin composition, which includes a polymer and at least one photosensitive compound. The polymer includes a homopolymer or copolymer formed from amides, amic acids, imides, hydroxyamides or benzoxazoles as monomers, and at least one of the side chains and terminals of the polymer has a nitrogen-containing group , the nitrogen-containing group has the structure shown in formula (i). Thereby, the photosensitive resin composition can have good stability, and the photosensitive resin prepared from the photosensitive resin composition can have excellent sensitivity and adhesion.

Description

technical field [0001] The present invention relates to a kind of photosensitive resin composition, the photosensitive resin made by it and electronic device, and particularly relate to a kind of photosensitive resin composition with good stability (stability), the photosensitive resin composition made by it has good sensitivity (sensitivity) And adhesion (adhesion) photosensitive resin and electronic devices. Background technique [0002] Photosensitive resin is a widely used material in the electronics industry. Taking the emerging organic light emitting diode (Organic Light Emitting Diode, OLED) display components as an example, OLED display components have self-illumination, wide viewing angle, good resolution, fast response, low operating voltage, high brightness, flexibility, and no image afterimage and other advantages, and does not require backlight and liquid crystal interlayer, and has the advantages of lightness, portability, etc., and has become the focus of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004
CPCG03F7/004
Inventor 李柏毅李信宏佘明翰卓佩绮陈又铭
Owner DAXIN MATERIALS
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