Extrusion compound device and technology for high-peeling-strength glue-free composite material

A composite material and extrusion compounding technology, which is applied in lamination devices, lamination auxiliary operations, lamination, etc., can solve the problems of difficult control of temperature stability, elevated die temperature, difficulty in film formation and even burning. , to achieve the effect of increasing the activation reaction rate, increasing the mechanical interlocking force, and increasing the degree of activation

Active Publication Date: 2019-03-12
HUILONG PLASTICS MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, the peel strength of the packaging materials produced by this method is low, and it is often difficult to achieve the ideal state.
[0004] In order to improve the peel strength of the composite packaging material, there are currently two treatment methods: the first is to increase the temperature of the die head, the higher the temperature of the extruded resin when it reaches the composite place, the better the fluidity, and the substrate The better the bonding effect, the higher the peel strength; but in this treatment method, the stability of temperature is difficult to control. When the temperature is too low, the peel strength cannot be improved. Decomposition, it is difficult to form a film or even burnt, resulting in waste products. Therefore, the yield of this processing method is very low
The other is to increase the distance between the extrusion die and the composite roll, that is, to increase the height of the air gap L1, which is equivalent to increasing the oxidation distance. The molten resin is fully oxidized in contact with oxygen in the air at high temperature, resulting in partial polarity group, which is beneficial to the adhesion with the base material and improves the peel strength of the composite material; on the contrary, if the air gap height is too small, the oxidation time is short and the oxidation is insufficient, resulting in low peel strength of the composite material; however, if the air gap The gap height is too large, because the thickness of the extruded resin film is very thin, generally no more than 0.015mm, the cooling rate is too fast, which limits the degree of oxidation reaction, so when this method is used for processing, the peel strength of the composite packaging material is not only Difficult to rise, but will produce a phenomenon of decline

Method used

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  • Extrusion compound device and technology for high-peeling-strength glue-free composite material
  • Extrusion compound device and technology for high-peeling-strength glue-free composite material
  • Extrusion compound device and technology for high-peeling-strength glue-free composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0057] A kind of extruding composite equipment of high peel strength glue-free composite material in this embodiment, such as image 3 As shown, it includes a substrate unwinding device 12, a polarization treatment device 13, a composite device 15, a winding device 22, a co-extrusion extruder 16 and a carrier energy guide device 17, a substrate unwinding device, a polarization treatment device, The composite device and the winding device are arranged in sequence along the conveying direction of the substrate, the co-extrusion extruder is arranged above the composite device, a composite area is formed in the composite device, and an activation area H is formed between the die of the co-extrusion extruder and the composite device. The activation area is located above the composite area, and a carrier energy guide device is installed in the activation area; the base material released by the base material unwinding device (that is, the main unwinding base material 3) is first subje...

Embodiment 2

[0079] This embodiment is an extrusion lamination equipment for high peel strength glue-free composite materials. Compared with Embodiment 1, the difference is that an oven 14 is also provided between the polarization treatment device and the lamination device. Among them, whether the oven is started to use can be selected according to the actual needs of the prepared composite material. In addition, along the conveying direction of the base material, glue rollers can also be installed in front of the oven, so that this equipment can be used not only in the production of composite materials without glue, but also in the production of composite materials with glue. The user can choose according to the production needs. Thereby making this equipment use wider.

Embodiment 3

[0081] A kind of extruding composite equipment of high peel strength glue-free composite material in this embodiment, such as image 3 As shown, compared with Embodiment 1, the difference is that an oven 14 is also provided between the polarization treatment device and the recombination device. Among them, whether the oven is started to use can be selected according to the actual needs of the prepared composite material. Along the conveying direction of the substrate, glue rollers can also be installed in front of the oven, so that this equipment can be used not only in the production of composite materials without glue, but also in the production of composite materials with glue. The user can choose according to the production needs, so that This device is used in a wider range.

[0082] The extrusion compounding equipment also includes an interlayer unwinding device 19. The interlayer unwinding device releases the interlayer material and sends it to the compound device, whe...

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Abstract

The invention discloses an extrusion compound device and technology for a high-peeling-strength glue-free composite material. A base material unreeling device, a polarization treatment device, a compound device body, a reeling device, a co-extrusion extruder and a carrier wave energy guiding device are included. The base material unreeling device, the polarization treatment device, the compound device body and the reeling device are sequentially arranged in the base material conveying direction. The co-extrusion extruder is arranged above the compound device body. A compound area is formed inthe compound device body. An activation area is formed between a die head of the co-extrusion extruder and the compound device body and located above the compound area, and the carrier wave energy guiding device is arranged in the activation area. A base material is subjected to surface polarization treatment through the polarization treatment device, an extruded extrusion film is subjected to activation treatment through the carrier wave energy guiding device, and then the base material and the extrusion film are compounded in the compound device body and finally conveyed to the reeling device to be reeled. Through the extrusion compound device and technology, the high-peeling-strength composite film not containing glue can be prepared, environment friendliness is achieved, toxicity is avoided, and a large number of high-peeling-strength composite films not containing glue can be applied to the food and medicine packaging industry.

Description

technical field [0001] The invention relates to the technical field of manufacturing plastic flexible packaging materials, in particular to an extrusion compounding equipment and process of high peel strength glue-free composite materials. Background technique [0002] In the plastic flexible packaging industry, in traditional packaging materials, in order to have a higher peel strength between the film layers in the packaging material, glue is generally added between the film layers to make them bond together. However, in the actual production process, the solvent in these glues volatilizes and releases toxic substances such as VOC, and due to the good compatibility between the organic solvent and the adhesive, it is difficult for the organic solvent to completely volatilize, so that part of it remains in the final product. When packaging materials are used in food and drug packaging, there is a risk of residual organic solvents migrating to the packaging contents, which wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C48/305B29C48/25B29C71/04B32B37/10B32B38/00
CPCB29C71/04B32B37/10B32B38/0008
Inventor 许锦才黄伟伦沈金强
Owner HUILONG PLASTICS MACHINERY
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