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Low density and high thermal conductivity silica gel gasket and preparation method thereof

A silicone gasket, high thermal conductivity technology, applied in the field of silicone, can solve problems such as reducing thermal conductivity, achieve good mechanical properties, reduce use costs, and improve mechanical properties.

Inactive Publication Date: 2019-03-15
睿高达(东莞)材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Zl 201611090517.X discloses a low-density high-strength thermal silica gel gasket. The silica gel gasket is made of organic silicon polymer and heat-conducting powder as the basic raw material, but the corresponding thermal conductivity is also low. Reduced, unable to meet the dual requirements of current electronic technology for high thermal conductivity and low density

Method used

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  • Low density and high thermal conductivity silica gel gasket and preparation method thereof
  • Low density and high thermal conductivity silica gel gasket and preparation method thereof
  • Low density and high thermal conductivity silica gel gasket and preparation method thereof

Examples

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Effect test

Embodiment 1

[0042] A low-density high-thermal-conduction silica gel gasket, comprising the following raw materials in parts by weight,

[0043]

[0044] Wherein, the silane coupling agent modified aluminosilicate is prepared by the following method: (a) adding aluminosilicate and silane coupling agent to absolute ethanol to form an ethanol solution; wherein the silane coupling agent The addition amount of the aluminosilicate is 1% of the weight sum of the aluminosilicate; the mass percentage of the sum of the weight of the aluminosilicate and the silane coupling agent in the ethanol solution is 1.5%, and the reaction is stirred and reacted for 30min at room temperature and normal pressure, The stirring speed is 60 rpm; (b) baking at 120° C. for 30 minutes to obtain the silane coupling agent-modified aluminosilicate.

[0045] Wherein, the aluminosilicate is a mixture composed of particle sizes of 1-5 μm, 8-15 μm and 15-25 μm respectively, with a mass ratio of 1:1:1.

[0046] Wherein, the...

Embodiment 2

[0060] A low-density high-thermal-conduction silica gel gasket, comprising the following raw materials in parts by weight,

[0061]

[0062] Wherein, the silane coupling agent modified aluminosilicate is prepared by the following method: (a) adding aluminosilicate and silane coupling agent to absolute ethanol to form an ethanol solution; wherein the silane coupling agent The addition amount is 1.5% of the weight of aluminosilicate; The mass percent of the weight sum of described aluminosilicate and silane coupling agent in ethanol solution is 2.0%, stirred and reacted 60min at room temperature and normal pressure, wherein The stirring speed is 60 rpm; (b) baking at 100° C. for 40 minutes to obtain the silane coupling agent-modified aluminosilicate.

[0063] Wherein, the aluminosilicate is a mixture composed of particle diameters of 1-5 μm, 8-15 μm and 15-25 μm respectively in a mass ratio of 1:3:1.

[0064] Wherein, the weight ratio of the silane coupling agent in the step...

Embodiment 3

[0078] A low-density high-thermal-conduction silica gel gasket, comprising the following raw materials in parts by weight,

[0079]

[0080] Wherein, the silane coupling agent modified aluminosilicate is prepared by the following method: (a) adding aluminosilicate and silane coupling agent to absolute ethanol to form an ethanol solution; wherein the silane coupling agent The addition amount is 2.0% of aluminosilicate weight; The mass percent of the sum of the weight of described aluminosilicate and silane coupling agent in ethanol solution is 2.5%, stir reaction 40min under room temperature and pressure condition, wherein The stirring speed is 50 rpm; (b) baking at 100° C. for 50 minutes to obtain the silane coupling agent-modified aluminosilicate.

[0081] Wherein, the aluminosilicate is a mixture composed of particle sizes of 1-5 μm, 8-15 μm and 15-25 μm respectively, and a mass ratio of 1:2:5.

[0082] Wherein, the weight ratio of the silane coupling agent in the step (...

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Abstract

The invention belongs to the technical field of silica gel, and particularly relates to a low density and high thermal conductivity silica gel gasket and a preparation method thereof. The low densityand high thermal conductivity silica gel gasket is prepared from the following raw materials: modified vinyl silicone oil, methyl vinyl silicone resin, hydrogen-containing silicone oil, silane coupling agent modified aluminosilicate and a catalyst. The invention further discloses the preparation method of the low density and high thermal conductivity silica gel gasket. The silane coupling agent modified aluminosilicate is added into a silica gel mixture, and is pressed after vacuum stirring reaction. The silica gel gasket has the characteristics of low density, high thermal conductivity and low cost, and is not easy to wear and crack. The preparation method is simple and easy to operate, and the prepared silica gel gasket has high consistency and is suitable for large-scale production.

Description

technical field [0001] The invention belongs to the technical field of silica gel, and in particular relates to a low-density, high-thermal conductivity silica gel gasket and a preparation method thereof. Background technique [0002] Thermally conductive silica gel sheet is a kind of thermally conductive interface material synthesized by a special process with organosiloxane as the base material and metal and non-metal simple substance or oxide as the filling material. In the industry, there are thermal silicone pads, thermal silicone sheets, thermal pads, heat dissipation silicone and so on. It is mainly used to fill the contact gap between the heat source and the contact surface of the heat sink, transfer heat, and reduce the temperature of the heat source. At the same time, the thermally conductive silicone sheet has good insulation, long-term elasticity, good high and low temperature aging resistance, etc., and also plays the role of insulation, shock absorption, seali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/06C08K3/34C09K5/14
CPCC08K2201/003C08K2201/014C08L83/04C08L2203/20C08L2205/035C09K5/14C08K9/06C08K3/34
Inventor 黄泽任马志求钟欣
Owner 睿高达(东莞)材料科技有限公司