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Flux for high temperature solder paste and preparation method thereof

A flux and high-temperature soldering technology, applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve the problems around oxidized solder joints, flux splashing, blackening, etc., to improve color, improve weldability, and high activation temperature Effect

Active Publication Date: 2021-04-30
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the solder paste used for soldering of semiconductors with a temperature above 280°C, due to the high soldering temperature, will cause problems such as flux splashing, oxidation, and blackening around the solder joints during the soldering process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Prepare raw materials according to the following mass ratios:

[0011] Docosanedioic acid 8.0%;

[0012] Stearic acid 1.0%;

[0013] 2,3-Dibromosuccinic acid 1.0%;

[0014] PW-9225 0.5%;

[0015] N-decyl ether 10.0%;

[0016] Glycerol 10%;

[0017] n-octyl ether 15.0%;

[0018] Castor Oil 3.5%;

[0019] 6650R 6.0%;

[0020] Polymerized Rosin 140 15.0%;

[0021] KE-604 Rosin 30.0%.

[0022] Prepare flux for high-temperature solder paste as follows: Put KE-604 rosin and polymerized rosin 140 into a reaction kettle, melt rosin at 180°C to 200°C; mix and prepare n-decyl ether, glycerin and n-octyl ether Slowly add the solvent into the molten rosin, keep the temperature at 170°C to 180°C, stir for 10 minutes, then add the active agent mixed with docosanedioic acid, stearic acid and 2,3-dibromosuccinic acid and high temperature resistant Oxygen agent PW-9225, stirred for 10 minutes; then cooled the material to 150°C-160°C, finally added the thixotropic agent mixed w...

Embodiment 2

[0024] Prepare raw materials according to the following mass ratios:

[0025] Docosanedioic acid 5.0%;

[0026] Adipic acid 1.0%;

[0027] Glutaric acid 2.0%;

[0028] PW-9225 1.0%;

[0029] N-decyl ether 20.0%;

[0030] Glycerol 20.0%;

[0031] Castor Oil 3.0%;

[0032] 6650R 6.0%;

[0033] Polymerized Rosin 120 10.0%;

[0034] Polymerized Rosin 140 10.0%;

[0035] KE-604 Rosin 22.0%.

[0036] Prepare flux for high-temperature solder paste as follows: put KE-604 rosin, polymerized rosin 120 and polymerized rosin 140 into a reaction kettle, melt rosin at 180°C to 200°C; mix n-decyl ether and glycerin Slowly add the solvent into the molten rosin, keep the temperature at 170°C to 180°C, stir for 12 minutes, then add the active agent mixed with docosanedioic acid, adipic acid, and glutaric acid and the high-temperature antioxidant PW-9225, Stir for 8 minutes; then cool the material to 150°C to 160°C, and finally add castor oil and 6650R thixotropic agent, stir for 33 mi...

Embodiment 3

[0038] Prepare raw materials according to the following mass ratios:

[0039] Docosanedioic acid 4.5%;

[0040] Azelaic Acid 1.0%;

[0041] Sebacic Acid 1.0%;

[0042] PW-9225 0.1%;

[0043] N-decyl ether 10.0%;

[0044] n-octyl ether 20.0%;

[0045] Castor Oil 2.0%;

[0046] 6650R 8.0%;

[0047] Polymerized Rosin 120 18.4%;

[0048] KE-604 Rosin 35.0%.

[0049] Prepare the flux for high-temperature solder paste as follows: put KE-604 rosin and polymerized rosin 120 into a reaction kettle, melt the rosin at 180°C to 200°C; slowly add the solvent prepared by mixing n-decyl ether and n-octyl ether to melt In the rosin, keep the temperature at 170°C-180°C, stir for 8 minutes, then add the active agent mixed with docosanedioic acid, azelaic acid, and sebacic acid, and the high-temperature antioxidant PW-9225, and stir for 8 minutes; Then cool the material to 150°C to 160°C, finally add the thixotropic agent mixed with castor oil and 6650R, pour it into a glass container a...

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Abstract

A flux for high-temperature solder paste and a preparation method thereof, wherein the flux includes 5.0% to 10.0% of an active agent, 0.1% to 1.0% of a high temperature antioxidant, 30.0% to 40.0% of a solvent, and 3.0% to 10.0% of a thixotropic agent, The balance is a film-forming agent; the active agent is docosanedioic acid and glutaric acid, adipic acid, azelaic acid, sebacic acid, stearic acid, 2,3-dibromosuccinic acid One or more; the high-temperature antioxidant is PW-9225; the solvent is one or both of n-decyl ether, glycerin, and n-octyl ether, and the boiling point of the solvent is higher than 280°C; the The thixotropic agent is a mixture of castor oil and 6650R; the film-forming agent is a mixture of KE-604 rosin and polymerized rosin. The flux of the present invention has strong activity, good weldability and stability, is not easy to splash, can avoid oxidation and blackening around solder joints, and is suitable for high-temperature series solder paste products with a temperature above 280°C.

Description

technical field [0001] The invention relates to the technical field of flux for solder paste and its preparation method. As a flux material for SMT, the flux is suitable for a series of alloy powder solder paste products with a soldering temperature above 280°C. Background technique [0002] Solder paste is mainly used in surface mount technology (SMT) welding. With the development of electronic information equipment, SMT has become the mainstream technology of electronic assembly, and its usage is increasing day by day. [0003] There are many types of fluxes for solder paste, and their composition ratios and applicability are different. At present, the solder paste used for soldering of semiconductors with a temperature above 280°C, due to the high soldering temperature, will cause problems such as flux splashing, oxidation, and blackening around the solder joints during the soldering process. Contents of the invention [0004] The purpose of the present invention is to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/36B23K35/362B23K35/40
Inventor 秦俊虎白海龙武信何欢卢梦迪王艳南刘宝权段雪霖吕金梅张欣沈海斌周建东唐丽朵云琨赵玲彦
Owner 云南锡业新材料有限公司
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