Low noise amplifier chip package structure and satellite tuner circuit

Abstract

The present invention relates to a low-noise amplifier chip packaging structure and a satellite tuner circuit, the packaging structure includes: a lead frame, including a bare chip layout area and at least six pins, the at least six pins surround the The die layout area is placed; the first die and the second die are placed in the die layout area, and the die layout area is electrically connected to at least two pins, and the first die includes a first FET structure, the second die includes a second FET structure, and the sources of the first FET structure and the second FET structure are electrically connected to the die layout area through wires, the first FET structure and The gate and the drain of the second FET structure are respectively electrically connected to different pins isolated from the layout area of ​​the die through wires. The package structure of the low noise amplifier chip can improve the integration degree of the satellite tuner circuit.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a low-noise amplifier chip packaging structure and a satellite tuner circuit. Background technique [0002] With the rapid development of information technology and the rapid development of integrated circuits, the most important and core low-noise amplifier technology in integrated circuits has also been greatly developed. With the rapid development of satellite technology in recent years, Ku-band satellite TV can be seen everywhere and plays an increasingly important role in people's daily entertainment life. People are increasingly inseparable from the variety of satellite TV. [0003] The low-noise amplifier is located at the front end of the receiver, and its main function is to amplify weak signals, which plays a vital role in reducing noise interference and improving the performance of the entire receiver. Therefore, low noise amplifiers have always been the key mi...

AI Technical Summary

Problems solved by technology

At present, the traditional low-noise amplifier chip SOD-4 packaging method has the defects of large packaging area, high cost and high noise

Moreover, the traditional low-noise amplifier chip SOD-4 packaging method needs to use two low-noise amplifier chip packaging structures to process the vertically polarized signal and the horizontally polarized signal respectively in the application of the Ku-band satellite TV tuner, and Peripheral circuits need to be designed separately for vertical polarization and horizontal polarization, which greatly increases the design cost and design time, and greatly increases the area of ​​the receiver, hinders the miniaturization of integrated circuits, and brings many disadvantages

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