Preparation method of Cu/TiO2 catalyst

A catalyst and reducing agent technology, applied in the field of catalyst preparation, can solve the problem of uneven surface distribution, achieve high catalytic activity, achieve precise control, and high shape retention.

Inactive Publication Date: 2019-03-29
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For the above-mentioned deficiencies that exist in the prior art, the purpose of the present invention is to provide a kind of Cu / TiO 2 The preparation method of the catalyst solves the difficulty in making Cu on TiO 2 The problem of uneven surface distribution

Method used

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  • Preparation method of Cu/TiO2 catalyst
  • Preparation method of Cu/TiO2 catalyst
  • Preparation method of Cu/TiO2 catalyst

Examples

Experimental program
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Effect test

Embodiment 1

[0037] This embodiment prepares Cu / TiO 2 (TiO 2 Particle diameter is 10nm) the step of catalyst is as follows:

[0038] (1) Enter the vaporized copper precursor into the gas phase adsorption system in the form of pulse, the pulse time is 12s, so that the copper precursor is adsorbed on the nano-TiO 2 surface;

[0039] (2) Nitrogen gas is filled into the system for purging, and the unadsorbed precursor and by-products in the system are removed from the system. Among them, N 2 The purging treatment time is 20s, the nitrogen flow rate is 180mL / min, and the system pressure is maintained at 4×10 3 Pa;

[0040] (3) Introduce hydrogen into the system, the flow rate is 180mL / min, the inflation time is 500ms, and the system pressure is maintained at 4×10 3 Pa, will be adsorbed on nano-TiO 2 The precursor on the surface is reduced to copper;

[0041] (4) Nitrogen is passed into the system, and the excess H 2 and by-products are removed from the system, where N 2The purging tre...

Embodiment 2

[0045] This embodiment prepares Cu / TiO 2 (TiO 2 Particle diameter is the step of 100nm) catalyst as follows:

[0046] (1) Put the gasified copper precursor into the gas phase adsorption system in the form of pulse, the pulse time is 6s, so that the copper precursor is adsorbed on the nano-TiO 2 surface;

[0047] (2) Nitrogen gas is filled into the system for purging, and the unadsorbed precursor and by-products in the system are removed from the system. Among them, N 2 The purge treatment time is 10s, the nitrogen flow rate is 150mL / min, and the system pressure is maintained at 3×10 3 Pa;

[0048] (3) Introduce NH into the system 3 , the flow rate is 150mL / min, the inflation time is 300ms, and the system pressure is maintained at 3×10 3 Pa, will be adsorbed on nano-TiO 2 The precursor on the surface is reduced to copper;

[0049] (4) Nitrogen is passed into the system, and the excess NH 3 and by-products are removed from the system, where N 2 The purging treatment t...

Embodiment 3

[0053] This embodiment prepares Cu / TiO 2 (TiO 2 Particle diameter is the step of 50nm) catalyst as follows:

[0054] (1) Enter the vaporized copper precursor into the gas phase adsorption system in the form of pulse, the pulse time is 8s, so that the copper precursor is adsorbed on the nano-TiO 2 surface;

[0055] (2) Nitrogen gas is filled into the system for purging, and the unadsorbed precursor and by-products in the system are removed from the system. Among them, N 2 The purge treatment time is 15s, the nitrogen flow rate is 200mL / min, and the system pressure is maintained at 6×10 3 Pa;

[0056] (3) Pass hydrazine vapor into the system, the flow rate is 200mL / min, the inflation time is 400ms, and the system pressure is maintained at 6×10 3 Pa, will be adsorbed on nano-TiO 2 The precursor on the surface is reduced to copper;

[0057] (4) Nitrogen is passed into the system, and the excess NH 3 and by-products are removed from the system, where N 2 The purge treatme...

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Abstract

The invention discloses a preparation method of a Cu / TiO2 catalyst, comprising the following steps: (1) introducing a vaporized copper precursor into a gas phase adsorption system in a pulse form to adsorb the copper precursor on the surface of nano-TiO2; (2) purging by introducing an inert gas into the system; (3) introducing a reducing agent into the system to reduce the copper precursor adsorbed on the nano-TiO2 to copper; (4) purging by introducing an inert gas into the system to obtain the Cu / TiO2 catalyst. By the method of the invention, Cu can be uniformly distributed on the surface ofTiO2, not changing the pore structure and specific surface area of TiO2. The catalyst has high shape preservation and catalytic activity, and precise control of Cu content can be achieved.

Description

technical field [0001] The invention belongs to the field of catalyst preparation, in particular to a method for preparing subnano-scale Cu / TiO by gas phase adsorption chemical reaction 2 catalyst method. technical background [0002] TiO 2 It has been widely studied because of its low price, no pollution, high catalytic activity and strong oxidation ability. But pure TiO 2 There are two major defects: (1) the band gap is narrow, making it difficult to make full use of the light source; (2) the excited electron-hole pairs are easily recombined, and the quantum yield is low. To promote TiO 2 The research on photocatalytic performance is mostly achieved by element doping. in TiO 2 Among supported catalysts, noble metals such as Pd, Au, and Ag are commonly used active components, but these metals are expensive, which greatly limits the application of these catalysts. Cu is widely used in the field of catalysis due to its non-toxicity, low cost, high light absorption coef...

Claims

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Application Information

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IPC IPC(8): B01J23/72
CPCB01J23/72
Inventor 丁玉强高凤杜立永江杰
Owner JIANGNAN UNIV
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