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Chip laser processing method

A laser processing and chip technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as defocusing, focus deviation, and low precision at different positions, so as to optimize performance, improve yield rate, and improve reliability Effect

Active Publication Date: 2019-03-29
北京中科镭特电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantages of this method: simple operation, low equipment requirements, and good etching selectivity; disadvantages: first, a photolithography process is required for each chip, which is time-consuming and laborious; Liquid, complex corrosion process, low precision, easy to damage the bottom readout circuit
The advantages of dry etching: the first etching selectivity and anisotropy are good, the second etching pattern can be precisely controlled and the resolution is high; the disadvantages: first, a single chip needs to be photolithography, which is time-consuming and laborious, and the second is damage Bottom readout circuit
These methods are expensive to prepare, require a special optical module, and the system is complex, using multiple optical devices, the system adjustment is difficult, and any deviation will lead to a deviation in the focus; one is to tilt the sample, but tilting the sample will cause the processing It is very inconvenient, and it is easy to cause defocusing in different positions
Most importantly, the existing tilting sample equipment can only be used for one-dimensional processing

Method used

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Effect test

Embodiment 1

[0050] Embodiments of the present invention provide a method for laser processing chips, such as figure 1 As shown, the method includes:

[0051] S11. Build a laser processing system with lasers and optical components;

[0052] S12. Acquiring the position information of the workbench where the cooled infrared detection chip is placed;

[0053] S13. Set the processing parameters of the laser processing system according to the position information, and generate the laser processing beam according to the processing parameters by the laser processing system;

[0054] S14. Changing the relative position of the laser processing beam and the cooled infrared detection chip, so that a closed annular groove is formed between the pixel layer and the edge on the cooled infrared detection chip.

[0055] The method for laser processing chips provided by the embodiments of the present invention mainly uses laser processing systems to generate laser beams to prepare closed annular grooves o...

Embodiment 2

[0108] The difference between this embodiment and Embodiment 1 is that a single laser processing beam can not be used for laser cutting to obtain a groove bottom structure with high flatness. Therefore, the embodiment of the present invention provides a method for laser processing chips, such as Figure 6 As shown, the method includes:

[0109] S41. Build a laser processing system with lasers and optical components;

[0110] S42. Obtain the position information of the workbench where the cooling type infrared detection chip is placed;

[0111] S43. Set the processing parameters of the laser processing system according to the position information, and generate the laser processing beam according to the processing parameters by the laser processing system;

[0112] S44. Process the photosensitive layer of the cooled infrared detector chip with the laser processing beam with the first power to form two parallel grooves, and then process the cooled infrared detector chip between ...

Embodiment 3

[0143] The difference between this embodiment and the above-mentioned embodiment is that the narrower the width of the prepared groove, the better, and the depth just penetrates to the bottom readout chip circuit layer, and the two sides of the groove are steep, which is conducive to the release of stress; therefore, the embodiment of the present invention provides A method of laser processing chips, such as Figure 8 As shown, the method includes:

[0144]S51. Build a workbench with adjustable angle, and place the refrigerated infrared detection chip to be processed on the workbench;

[0145] S52, setting the adjustment and compensation process parameters of the workbench, and the laser parameters of the laser processing system built by the laser and optical components;

[0146] S53. Change the angle of the workbench at least once according to the laser parameters, adjust and compensate the process parameters, so that the laser processing system performs inclined processing ...

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Abstract

The invention provides a chip laser processing method. The method comprises the steps that an angle-adjustable workbench is constructed, and a refrigeration type infrared detection chip to be processed is placed on the workbench; adjusting and compensating technological parameters of the workbench and laser parameters of a laser processing system constructed by a laser device and an optical element are set; according to the laser parameters and the adjusting and compensating technological parameters, the angle of the workbench is adjusted at least one time, and therefore the laser processing system carries out inclined processing on the portion between a picture element layer and the edge of the refrigeration type infrared detection chip so as to form an edge small-included-angle shallow groove. The groove type structure of the prepared groove can be improved, the groove heat effect area produced in the laser processing process is effectively controlled, the performance of the refrigeration type infrared detection chip is further optimized, and the preparation yield is improved.

Description

technical field [0001] The invention relates to the technical field of laser micromachining, in particular to a method for laser machining chips. Background technique [0002] Infrared detectors have been well used in both civil and military applications, and the performance of cooled infrared detectors is particularly excellent. The infrared detection chip in the cooling type infrared detector is often in an environment with drastic temperature changes. In order to ensure its normal working performance, the infrared detection chip in the detector needs to be cooled with liquid nitrogen during the working state. The temperature at this time is about It is -200°C, but during non-working hours, the infrared detection chip is exposed to the atmospheric temperature. For example, the highest temperature in the desert can sometimes reach about 70°C, so the ambient temperature of the infrared detection chip is between -200°C and Constantly changing between 70°C. [0003] The stru...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/364B23K26/064B23K26/70
CPCB23K26/0643B23K26/0648B23K26/064B23K26/364B23K26/702
Inventor 侯煜李曼张喆王然李纪东张紫辰
Owner 北京中科镭特电子有限公司
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