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Micro-adhesion protection film, preparation method and applications thereof

A protective film and micro-adhesive technology, applied in adhesives, pressure-sensitive films/sheets, film/sheet-shaped adhesives, etc., can solve problems such as large viscosity climb, interference of electronic components, residual glue, etc., and achieve stable viscosity , The effect of small change in peeling force

Inactive Publication Date: 2019-04-02
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the commonly used micro-adhesive protective film is an adhesive film formed by coating a pressure-sensitive adhesive on a PET, PEN or PI film, such as a high-temperature resistant acrylic protective film and a temperature-resistant silicone protective film. However, because it is aimed at the electronics industry , end customers have high requirements for environmental protection, and excessive silicon content will cause interference to electronic components. In addition, the currently used micro-adhesive protective film has a relatively large viscosity increase after high-temperature pressing, and there is a risk of residual glue

Method used

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  • Micro-adhesion protection film, preparation method and applications thereof
  • Micro-adhesion protection film, preparation method and applications thereof
  • Micro-adhesion protection film, preparation method and applications thereof

Examples

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Embodiment 1

[0029] Such as figure 1 As shown, this embodiment is a kind of slightly sticky protective film, which consists of a base material layer, an adhesive layer and a release layer from top to bottom. The substrate layer is a 12.5 μm PI film, the thickness of the adhesive layer is 15 μm, and the release layer is a silicone release film with a thickness of 25 μm.

[0030] The preparation method of slightly sticky protective film comprises the steps:

[0031] S1: Preparation of high-temperature-resistant acrylic masterbatch: Methyl methacrylate: butyl acrylate: ethyl acrylate: acrylic acid: acrylamide with a mass ratio of 32:52:10:2:4, and ethyl acetate to make 30% Masterbatch with solid content;

[0032] S2: Take 100g of the masterbatch prepared in step S1, add 1.8g of hexamethylene diisocyanate curing agent (wherein the solvent is mainly ethyl acetate) with a solid content of 75%, stir for 20min to prepare a mixed solution, add the Leveling agent 1.5g, antioxidant 10101.5g, after...

Embodiment 2

[0035] Basically the same as Example 1, except that the mass ratio of methyl methacrylate: butyl acrylate: ethyl acrylate: acrylic acid: acrylamide is 22:62:10:2:4.

Embodiment 3

[0037] Basically the same as Example 1, except that the mass ratio of methyl methacrylate: butyl acrylate: ethyl acrylate: acrylic acid is 32:52:10:2.

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Abstract

The present invention relates to a micro-adhesion protection film, which comprises a base material layer and an adhesive layer arranged on one surface of the base material layer, wherein the raw materials of the adhesive layer comprise, by mass, 80-98% of a resin monomer, and 2-20% of a curing agent, the resin monomer is a polyurethane resin monomer, an acrylic resin monomer, an epoxy resin monomer, a hot melt adhesive monomer or an UV curable adhesive monomer, and the curing agent is an aliphatic curing agent. According to the present invention, the micro-adhesion protection film does not have the silicon transfer problem of the silica gel protection film, has advantages of stable viscosity, low time-dependent peeling force change and no residual glue, and is suitable for electronics industry.

Description

technical field [0001] The invention relates to a slightly sticky protective film and its preparation method and application. Background technique [0002] In the process of rigid-flex board manufacturing, a slightly sticky protective film is required. The role of the micro-adhesive protective film is to protect the surface of the product (material CVL or Cu) from damage during the hot-pressing process of the flexible board, and it is easy to tear after the hot-pressing process without leaving any glue residue. At present, the commonly used micro-adhesive protective film is an adhesive film formed by coating a pressure-sensitive adhesive on a PET, PEN or PI film, such as a high-temperature resistant acrylic protective film and a temperature-resistant silicone protective film. However, because it is aimed at the electronics industry , End customers have high requirements for environmental protection, and excessive silicon content will cause interference to electronic compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J7/25C09J4/02
CPCC08J2433/00C09J4/00C09J7/25C09J7/385C09J2301/122C09J2479/086
Inventor 李阜阳沈秦飞陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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