A kind of processing method of ptfe circuit board hole
A processing method and board hole technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of hole burrs, drilling dirt in the hole, poor efficiency, hindering chip removal, etc., to improve hole quality, Effect of reducing poor chip removal and reducing chip volume
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Embodiment 1
[0031] This embodiment is a PTFE circuit board without glass fiber and no filler, the aperture size is 0.5mm, and the processing steps are as follows:
[0032] Such as figure 1 As shown, first process two positioning pin holes 10 with a diameter of 3.175mm on the 1 side of the PTFE circuit board to ensure that the subsequent pre-drilled small hole and the target hole are not biased when the two clampings are performed, and the positioning pin is used to position the plate. For the target hole 2 position of 0.5mm, use a mechanical drill (or laser drill) to pre-drill a pre-drilled hole 3 with a concentric hole diameter of 0.3mm, such as figure 2 shown;
[0033] Then pre-treat the pre-drilled plate with small holes such as plasma desmear removal and plate washing, and then add a layer of surface strengthening layer on the wall of the pre-drilled hole 3, such as image 3 As shown, the strengthening layer is the electroplating strengthening layer 4, which is increased by direct ...
Embodiment 2
[0037] Such as Figure 4 As shown, other methods of this embodiment are the same as in Embodiment 1, except that the electroplating strengthening layer is replaced with a resin plugging strengthening layer 5, and the plugging steps are as follows:
[0038] First, place the PCB to be resin plugged on the resin plugging machine, and perform resin plugging on the PCB board to be resin plugged by the resin plugging machine; second, transfer the resin plugged PCB to the curing furnace for curing The resin is cured, and the cured PCB board is transferred to the grinder; thirdly, the resin is ground by the grinder and washed by the horizontal washing line, and then transferred to the automatic board receiving machine, which automatically receives the board to realize automatic resin plugging and grinding.
Embodiment 3
[0040] Such as Figure 4 As shown, other methods of the present embodiment are the same as in Example 1, except that the electroplating strengthening layer is replaced with an ink plugging strengthening layer 5, and the plugging steps are as follows:
[0041] Solder mask plug hole → silk screen solder mask surface oil → pre-baking, alignment, exposure and development → segmental high temperature baking → silk screen characters. Among them, the segmented high-temperature baking is specifically: the baking is divided into 6 stages: the first stage: bake at 60°C ± 5°C for 60 minutes; the second stage: bake at 70°C ± 5°C for 30 minutes; the third stage: Bake at 90°C±5°C for 30 minutes; the fourth stage: bake at 70°C±5°C for 30 minutes; the fifth stage: bake at 110°C±5°C for 30 minutes; the sixth stage: bake at 150°C±5°C for 60 minutes minute.
[0042] Beneficial effects of this embodiment: 1. Adopt the method of pre-drilling small holes, reduce the amount of chips, and reduce th...
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Abstract
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