Flexible filament substrate coated with graphene on back and preparation process thereof

Abstract

The invention relates to a flexible filament substrate coated with graphene on the back, which comprises a substrate and a plurality of LED flexible filament strips which are inversely arranged on thetop of the substrate, wherein a graphene film is spread on the bottom of the substrate. The preparation process comprises the following five steps of: dispersing the graphene in an ethanol aqueous solution, filtering the dispersed graphene on a filter membrane in a vacuum filtering mode, then placing the filter membrane in deionized water for standing for 12 hours, and then adhering the filter membrane to the bottom of the substrate, and finally placing the filter membrane in an acetone solution to dissolve the filter membrane so as to finish the preparation process of the flexible filament substrate. The process has the advantages of simple steps, convenient operation and long service life, the graphene and the flexible filament substrate can be perfectly adhered without falling off, theheat dissipation of the flexible filament is enhenced, and the preparation of the high-power and high-light-efficiency LED filament can be achieved.

Description

technical field [0001] The invention relates to LED lighting, in particular to a flexible filament substrate coated with graphene on the back and a preparation process thereof. Background technique [0002] Because LED lamps have the characteristics of uniform light emission and energy saving, they are gradually replacing traditional tungsten filament and halogen lamps, and become the new favorite in the lighting industry. When the LED lamp is lit, its luminous brightness is limited by the power wattage. If the wattage is small, the luminous brightness is limited. To increase the luminous brightness, the wattage must be increased. Correspondingly, the area of ​​the light source and the bulb needs to be increased. ; At the same time, as the wattage increases, how to dissipate heat becomes a problem, because the greater the power, the greater the heat dissipation. In practical applications, many manufacturers will increase the power, light source and bulb area while increasin...

AI Technical Summary

Problems solved by technology

[0003] The flexible filament can be in any shape, and the welding wire can be solved by flip-chip technology. The flexible filament is generally a strip-shaped filament, which is cut from the substrate. However, due to the weak heat dissipation capacity of the flexible flip-chip filament, it is difficult to achieve high-power drive, so high light efficiency cannot be obtained

[0004] Graphene materials have the characteristics of large specific surface area and high thermal conductivity, but there is no effective method to attach graphene to flexible flip-chip filament substrates.

Images