High-temperature-resistant high-infrared-emission passive radiation cooling structure and cooling method

A radiative cooling and infrared emission technology, applied in the field of cooling, can solve the problems of high energy consumption for cooling and the inability to use active cooling, and achieve the effect of solving the cooling problem

Pending Publication Date: 2019-04-16
TIANJIN UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of large cooling energy consumption or the inability to use active cooling, and to provide a passive radiation cooling structure and cooling method with high temperature resistance and high infrared emission, which can provide passive cooling for some occasions and equipment, and play a role in cooling. cooling effect

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  • High-temperature-resistant high-infrared-emission passive radiation cooling structure and cooling method

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0026] Such as figure 1 As shown, the passive radiation cooling structure with high temperature resistance and high infrared emission of the present invention is composed of a composite material layer, which is arranged outside the object to be cooled 1, and the composite material layer includes a heat transfer layer arranged sequentially from the inside to the outside. Material layer 2, cooling material layer 3, thermal insulation cavity layer 4 and cover layer 5. The heat transfer material layer 2 is fully in contact with the cooled body 1, and the heat transfer resistance between the heat transfer material layer 2 and the cooled body 1 is reduced as much as possible, and the heat of the cooled body 1 is transferred to the cooling m...

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Abstract

The invention discloses a high-temperature-resistant high-infrared-emission passive radiation cooling structure and a cooling method. According to the high-temperature-resistant high-infrared-emissionpassive radiation cooling structure, polystyrene is dissolved in tetrahydrofuran, after the polystyrene is completely dissolved, pure water is added, and then a precursor solution is obtained; the tetrahydrofuran is evaporated, the polystyrene is separated from water and forms micropores, and then a cooling material layer is formed; the cooling material layer is attached to the surface of a heatconducting material layer; the cooling material layer is covered with a covering layer; a heat insulation cavity layer is formed between the cooling material layer and the covering layer; the heat conducting material layer, the cooling material layer, the heat insulation cavity layer and the covering layer form the passive radiation cooling structure; the heat conducting material layer makes contact with a cooled body, the covering layer is exposed in the outdoor environment, and the cooling material layer emits the heat of the cooled body in an infrared ray manner and reflects transmitted sunlight back. The high-temperature-resistant high-infrared-emission passive radiation cooling structure can provide passive type cooling for some occasions and equipment and achieves the cooling function.

Description

technical field [0001] The invention relates to the field of cooling, and more specifically relates to a passive radiation cooling structure and cooling method with high temperature resistance and high infrared emission. Background technique [0002] At present, many fields need to cool down, such as construction, military industry, electronics, mechanical equipment, etc. When the outdoor temperature of the building is high, air conditioning is needed to cool down; in the absence of air conditioning, electric fans or water evaporation are used to cool down. In the field of military industry, when the barrel or barrel fires bullets or shells for a while, the temperature rises, which affects the accuracy and must be stopped to cool down. [0003] In these occasions where active means cannot be used or for energy saving, the present invention can be used for cooling. Contents of the invention [0004] The purpose of the present invention is to solve the problem of large coo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B23/00
CPCF25B23/003
Inventor 周志华刘俊伟
Owner TIANJIN UNIV
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