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A semiconductor laser automatic welding device and welding method

An automatic welding and laser technology, which is applied in welding equipment, resistance welding equipment, manufacturing tools, etc., can solve the problems of automatic welding of undiscovered semiconductor lasers, prolong the life of semiconductor lasers, reduce the junction temperature of the active area of ​​lasers, etc., and achieve multi- The effect of uninterrupted production at the station, reduction of loss rate, and assurance of precision

Active Publication Date: 2021-08-03
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention adopts the combination structure of high thermal conductivity transitional heat sink and heat sink, especially the dual heat sink structure, which can effectively enhance the heat dissipation capacity of TO-packaged semiconductor lasers, greatly reduce the junction temperature of the active region of the laser, and reduce the heat dissipation of the laser. The thermal resistance prolongs the life of the semiconductor laser, but the processing technology is complicated and the equipment investment is high
[0005] At present, in the LD packaging industry, no suitable way has been found for automatic welding of semiconductor lasers

Method used

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  • A semiconductor laser automatic welding device and welding method
  • A semiconductor laser automatic welding device and welding method
  • A semiconductor laser automatic welding device and welding method

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Experimental program
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Effect test

Embodiment 1

[0039]The clamping positioning mechanism may be a structure, including a slider 20 that is slidably mounted on the positioning base 14, is mounted on the positioning block II 22 on the slider 20, and is mounted on the positioning block I 21 on the positioning base 14. The horizontal is disposed on the seat 1 and located at the lower end of the upper end of the upper electrode 8, and the positioning block II 22 is formed between the positioning hole 23 for receiving the tube cap 16 and the tube member 15, when the cylinder II 9 is formed. When the piston rod pushes the slider 20 to move toward the inner end, the diameter of the positioning hole 23 is reduced. When a certain bit base 14 on the disc 2 is waiting for welding, the piston rod of the cylinder II 9 extends outward, which pushes the slider 20 to move to the inner side, thereby positioning block II 22 and the positioning block. The pitch between the I 21 becomes smaller, and the inner diameter of the positioning hole 23 is ...

Embodiment 2

[0041] The electrode drive mechanism is a cylinder I 7 vertically mounted on the upper end of the seat 1, and the upper electrode 8 is mounted to the piston rod end of the cylinder I 7. The piston rod of the cylinder I 7 extends outward, which drives the upper electrode 8 downward movement, and its piston rod is retracted, and the upper electrode 8 is turned back, the structure is simple, and the operation is reliable.

Embodiment 3

[0043] Preferably, the rotary robot I 3 disposed on the base 1 is attached to the vacuum suction cup I 4 on the rotary robot I 3, and the rotary robot II 5 mounted on the base 1 and is mounted on the rotary robot II 5. Vacuum suction cup II6, rotary manipulator I 3 Place the tube cap 16 on the disc 2 by vacuum suction cup I 4, rotary robot II 5, by rotating robot II 5 and mounted on the rotary robot The holder 15 is placed on the respective positioning base 14 on the disc 2 on the disc 2. The automatic material of the tube seat 15 and the tube cap 16 is achieved, and the degree of automation of the entire welding device is further improved.

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Abstract

An automatic semiconductor laser welding device and welding method, comprising: a machine base, N fixed bases, a movable base, a positioning base, a lower electrode, an upper electrode, and a lower electrode contact. With the continuous rotation of the disk, each positioning base on it is continuously rotated to the bottom of the upper electrode, thereby realizing uninterrupted welding and multi-station uninterrupted production, which greatly improves the production efficiency of semiconductor lasers. Because the tube base and the tube cap are coaxially clamped and fixed by the clamping and positioning mechanism before welding, the accuracy of semiconductor laser welding is ensured, the loss rate is reduced, the pollution of the tube is reduced, and the consumption of raw materials is saved.

Description

Technical field [0001] The present invention relates to the field of semiconductor lasers, and more particularly to a semiconductor laser automatic welding device and a welding method. Background technique [0002] In the 1970s, the success of the semiconductor laser room temperature continuous oscillation and the implementation of low loss fibers opened the prelude of the optical electronic age. The semiconductor laser has a small size and light weight. efficient. The advantages of long life, easy to modulate and low prices, have been widely used in industrial, medical and military fields. This also promotes the industrialization of the semiconductor laser, due to technical issues such as production process, the semiconductor laser has three failure forms in the semiconductor laser, and the loss of loss failure. It must face how to eliminate early failure products in industrial production of semiconductor lasers. problem. [0003] China Patent Document CN10263354 B discloses a c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K11/00B23K11/31
CPCB23K11/00B23K11/31
Inventor 贾旭涛赵克宁汤庆敏肖成峰郑兆河
Owner Shandong Huaguang Optoelectronics Co. Ltd.