Mn-W-Cu-O-series sputtering target and preparation method thereof
A mn-w-cu-o, sputtering target technology, applied in sputtering plating, ion implantation plating, coating, etc., can solve the problem of high material cost and achieve the effect of suppressing abnormal discharge
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[0050] [Manufacturing method of Mn-W-Cu-O sputtering target]
[0051] Next, a method of preparing the target according to this embodiment will be described. The preparation method according to this embodiment includes a mixing step and a sintering step.
[0052] First, through a mixing step, the mixed powder containing manganese-containing powder, tungsten-containing powder, and copper-containing powder is wet-mixed for 10 hours or more.
[0053] As the manganese-containing powder, it can be appropriately selected according to the purpose, and a powder of a monomer or compound containing Mn, and the like can be mentioned. Among them, manganese oxide is preferred. As the manganese oxide, for example, Mn can be used 3 O 4 , Mn 2 O 3 , MnO, MnO 2 , MnO 3 , Mn 2 O 7 Wait. These can be used individually by 1 type or in combination of 2 or more types. Among the above-mentioned manganese oxides, Mn is preferred according to the relationship between the sintering temperature and the melt...
Embodiment 1
[0073] In Example 1, the following powders were prepared as raw material powders.
[0074] Mn 3 O 4 Powder (purity: 99.9% or more, average particle size: 5μm)
[0075] W powder (purity: 99.9% or more, average particle size: 2μm)
[0076] Cu powder (purity: 99.9% or more, average particle size: 1.5μm)
[0077] The above-mentioned raw material powder was weighed so that the ratio of each containing metal was Mn:W:Cu=30:40:30 (atom %). The weighed raw material powders, zirconia balls (diameter 5 mm) and alcohol (ethanol) 3 times the total weight of each raw material powder were put into a container, and a ball mill was used for 12 hours of wet mixing. After the mixed powder is dried, it is passed through a sieve with an aperture of 500 μm. Next, apply to the above mixed powder at a sintering temperature of 900°C for 2 hours, 200kgf / cm 2 The pressure is hot-pressed in an inert gas atmosphere to prepare a sputtering target. The shape of the sputtering target is a disc, and the size is 5...
Embodiment 2
[0079] In Example 2, a sputtering target was prepared by the same method as Example 1, except that the wet mixing time was set to 24 hours and the sintering temperature was set to 920°C.
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