A kind of ultra-thin heat pipe and its manufacturing process

Abstract

The invention belongs to the field of heat pipes and particularly relates to an ultrathin heat pipe and a manufacturing technology thereof. The ultrathin heat pipe comprises a flat copper pipe with two sealed ends, a capillary liquid absorbing core and a working medium. The capillary liquid absorbing core and the working medium are arranged in a copper pipe cavity. The wall thickness of the copperpipe is smaller than 0.3 mm. The total thickness of the copper pipe is smaller than 1 mm. The sealing width of the sealing ends of the ultrathin heat pipe is 1-5 mm. The sealing width of the ultrathin heat pipe reaches 1-5 mm, the sealing width is reduced greatly, the heat conducting efficiency of the heat pipe is improved beneficially, the size of the heat pipe is reduced, the arrangement spaceof the heat pipe in an electronic product is saved, the overall weight of the electronic product is reduced beneficially, and the yield is increased. A sealing and tailoring die can carry out tailoring work while the heat pipe is sealed, tight sealing of a pipe opening of the heat pipe and tailoring of the ineffective end are achieved through one step, pipe contracting does not need to be carriedout first, the manufacturing technology of the heat pipe is simplified greatly, and the machining period is shortened. After the copper pipe is flattened, liquid is injected, vacuumizing is carried out, the cavity space becomes small, the vacuum degree of the heat pipe is higher, and the heat efficiency of the heat pipe is improved.

Description

technical field [0001] The invention belongs to the field of heat pipes, and in particular relates to an ultra-thin heat pipe and a manufacturing process thereof. Background technique [0002] With the advancement of science and technology, today's electronic products are developing towards high function, high efficiency, and light and thin. Especially at present, 5G is the future development trend in the field of consumer electronics. Much higher than 4G chips, so the demand for heat dissipation in consumer electronics products will become stronger in the future. The increased power consumption of the chip has greatly increased the heat generated per unit area. How to quickly dissipate the heat of the chip has always been a difficulty and bottleneck in the industry. Therefore, superconducting thermal materials and heat dissipation materials that quickly conduct heat from chips need to be continuously improved and improved to solve the problem of chip heat dissipation in or...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the length of the invalid ends at both ends of the heat pipe is large, which affects the heat dissipation effect of the whole heat pipe, occupies a large space, and in the existing process, the heat pipe is bonded and then part of the bonded section is cut off, resulting in a cumbersome process. The present invention discloses a A kind of ultra-thin heat pipe and its manufacturing process,

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