Preparation method of mixed-voltage high frequency multilayer circuit
A multi-layer circuit and high-frequency technology, which is applied in the field of circuit boards, can solve problems such as increased production costs, high scrap rate, poor alignment accuracy between layers, etc., and achieves the effect of realizing electrical connection, accurate positioning, and simplicity and convenience
Inactive Publication Date: 2019-05-03
泰州市旺灵绝缘材料厂
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Problems solved by technology
Ordinary multi-layer circuit boards are not suitable for the above occasions due to their low temperature resistance, high dielectric constant, and large loss. In addition, the alignment accuracy between layers of ordinary multi-layer circuit boards is poor, resulting in a high scrap rate, virtually increased production costs
Method used
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[0027] The present invention will be described in further detail below in conjunction with the embodiments and accompanying drawings, so that those skilled in the art can implement it with reference to the description.
[0028] see Figure 1-7 As shown, the embodiment of the present invention discloses a method for preparing a mixed-voltage high-frequency multilayer circuit, including the following steps:
[0029] Step 1: Prepare materials: Prepare two layers of polytetrafluoroethylene fiberglass cloth copper clad board 1 and six layers of polyimide film copper clad layer 2, polytetrafluoroethylene fiberglass cloth copper clad board 1 and six layers of polyamide The size of the imide film copper clad layer 2 is the same, and the polytetrafluoroethylene glass fiber cloth copper clad laminate 1 and the polyimide film copper clad layer 2 are placed in a flattening jig and flattened to ensure flatness Spend;
[0030] Step 2: Setting holes: Evenly arrange eight first through hole...
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The invention discloses a preparation method of a mixed-voltage high frequency multilayer circuit. The method includes the following steps: step 1: preparing materials, namely a step of preparing polytetrafluoroethylene fiberglass cloth copper-clad foil boards and polyimide film copper-clad layers; step 2: arranging holes; step 3: positioning, namely a step of arranging conductive positioning columns; step 4: combining the polytetrafluoroethylene fiberglass cloth copper-clad foil boards, the polyimide film copper-clad layers and the conductive positioning columns; and step 5: cutting off the redundant conductive positioning columns. The preparation method enables polytetrafluoroethylene fiberglass cloth copper-clad foil board materials and the polyimide film copper-clad layers to be combined together to obtain an electronic component having a high-frequency effect; and the conductive positioning columns can position combination of the polytetrafluoroethylene fiberglass cloth copper-clad foil board materials and the polyimide film copper-clad layers, so that positioning is accurate, simple and convenient, and can play a conductive effect, thereby achieving electrical connection of the polytetrafluoroethylene fiberglass cloth copper-clad foil board materials and the polyimide film copper-clad layers.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for preparing a mixed-voltage high-frequency multilayer circuit. Background technique [0002] With the rapid development of the electronic information industry, the requirements for circuit boards are becoming more and more integrated, miniaturized and multi-functional, especially for aviation, aerospace, satellite communications, navigation, radar, electronic countermeasures and 3G communications. Multilayer circuit boards in the field of electronics and other fields are even more demanding. Ordinary multilayer circuit boards are not suitable for the above occasions due to their low temperature resistance, high dielectric constant, and large loss. In addition, the alignment accuracy between layers of ordinary multilayer circuit boards is poor, resulting in a high scrap rate, virtually Increased production costs. Contents of the invention [0003] In order to...
Claims
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Inventor 向锋刘超蒋文沈振春
Owner 泰州市旺灵绝缘材料厂