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High-adhesion polyamide hot melt adhesive and preparation method thereof

A polyamide hot-melt adhesive, high-viscosity technology, applied in the direction of polymer adhesive additives, adhesives, adhesive types, etc., can solve the problem that polyamide hot-melt adhesive sealing and bonding cannot achieve the waterproof effect of bonding, packaging problem, to achieve the effect of easy molding, simple use and excellent bonding performance

Inactive Publication Date: 2019-05-07
SHANDONG HIGHDEV NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for some materials with low surface energy, such as epoxy, PEEK, PPS, etc., sealing and bonding with existing polyamide hot-melt adhesives cannot achieve good bonding and packaging waterproof effects, and such materials are used for electronics and communications. Commonly used materials in the industry

Method used

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  • High-adhesion polyamide hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Add 36mol% high-purity dimer acid, 12mol% low-purity dimer acid, 2mol% adipic acid, 5.5mol% D2000, hypophosphorous acid with a mass fraction of 0.5%, 1098 with a mass fraction of 0.3%, etc. In the four-necked flask with protective device, thermometer and water separator, raise the temperature to 140°C, add 49.5mol% ethylenediamine dropwise at this temperature, pre-condense at a constant temperature for 0.5 hours, and keep stirring, raise the temperature to 220°C, and react for 3 hours , after evacuated and decompressed for 1 hour, finally add KPR-156 with a mass fraction of 3% under normal pressure, stir for 0.5 hours under nitrogen protection, and discharge.

Embodiment 2

[0020] Add 24mol% high-purity dimer acid, 24mol% low-purity dimer acid, 2mol% adipic acid, 5.5mol% D2000, hypophosphorous acid with a mass fraction of 0.5%, 1098 with a mass fraction of 0.3%, etc. In the four-necked flask with protective device, thermometer and water separator, raise the temperature to 140°C, add 49.5mol% ethylenediamine dropwise at this temperature, pre-condense at a constant temperature for 0.5 hours, and keep stirring, raise the temperature to 220°C, and react for 3 hours , after evacuated and decompressed for 1 hour, finally add KPR-156 with a mass fraction of 3% under normal pressure, stir for 0.5 hours under nitrogen protection, and discharge.

Embodiment 3

[0024] Add 48mol% high-purity dimer acid, 2mol% adipic acid, 5.5mol% D2000, hypophosphorous acid with a mass fraction of 0.5%, and 1098 with a mass fraction of 0.3%, etc., into a stirring device, a nitrogen protection device, a thermometer, and a water separator. In a four-neck flask, heat up to 140°C, add 49.5mol% ethylenediamine dropwise at this temperature, pre-condense at a constant temperature for 0.5 hours, and keep stirring, raise the temperature to 220°C, react for 3 hours, vacuumize and compress for 1 hour , and finally add KPR-156 with a mass fraction of 3% under normal pressure, stir for 0.5h under nitrogen protection, and discharge.

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Abstract

The invention discloses a high-adhesion polyamide hot melt adhesive and a preparation method thereof, and the high-adhesion polyamide hot melt adhesive comprises the following raw materials in percentage by weight: 20-49 mol % of a mixture of two aliphatic dimer acids, 1-30 mol % of a mixture of one or more of C4-C10 aliphatic dibasic acids, 0-15 mol % of polyether amine, 35-50 mol % a mixture ofone or more of aliphatic diamine or alicyclic diamine, 1-5% by mass of polyurethane acrylate, 0.1%-3% by mass of an antioxidant and 0.05%-0.2% by mass of a catalyst. The prepared high-adhesion polyamide hot melt adhesive has good affinity and excellent hot melt adhesion, after being rapidly cured, the high-adhesion polyamide hot melt adhesive can be bonded to a base material strongly.

Description

technical field [0001] The invention relates to hot-melt adhesives and a preparation method thereof, in particular to the field of polyamide hot-melt adhesives. Background technique [0002] Dimer acid polyamide hot melt adhesive has good electrical insulation performance, good bonding performance, low temperature toughness and high temperature creep, and dimer acid polyamide hot melt adhesive has changed the potting method of traditional adhesives. Low-pressure injection molding can complete packaging and bonding after rapid curing. The degree of production automation is high and the production efficiency is greatly improved. Therefore, it can be widely used in the packaging and bonding of electronic components, heat shrinkable sleeves, automotive filters, coils, etc. . [0003] However, for some materials with low surface energy, such as epoxy, PEEK, PPS, etc., sealing and bonding with existing polyamide hot-melt adhesives cannot achieve a good bonding and packaging water...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06C09J175/14C09J11/08C08G69/40C08G69/34
Inventor 胡倩苟曲廷刘克增李雪姜振龙
Owner SHANDONG HIGHDEV NEW MATERIAL TECH CO LTD