Thermal-shock-resistant heat dissipation device based on phase change material

A phase change material, thermal shock resistance technology, applied in cooling/ventilation/heating transformation, sealed enclosures, etc., can solve the problems of device damage, increase in inverter loss, etc., to achieve the effect of optimizing the shape size and fully absorbing heat

Inactive Publication Date: 2019-05-07
BEIJING RES INST OF PRECISE MECHATRONICS CONTROLS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the development of servo control, the loss of the inverter continues to rise, instantaneous thermal shock and continuous thermal coupling, if

Method used

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  • Thermal-shock-resistant heat dissipation device based on phase change material
  • Thermal-shock-resistant heat dissipation device based on phase change material
  • Thermal-shock-resistant heat dissipation device based on phase change material

Examples

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Embodiment Construction

[0023] Below in conjunction with accompanying drawing and embodiment, what the present invention proposes is further introduced:

[0024] A thermal shock heat dissipation device based on phase change materials, including a housing 101, an upper cover 102, screws 103, ribs 106 and a heating device 108; wherein the upper cover 102 is fixed above the housing 101 by screws 103, the The heating device 108 is disposed in the casing 101 , and a large number of ribs 106 are laid on the heating device 108 .

[0025] A sealing groove 105 is formed on the edge of the housing 101 .

[0026] The edge of the upper cover 102 is provided with a ring of protrusions, and the protrusions are stuck in the sealing groove 105 .

[0027] A sealant 104 is injected between the sealing groove 105 and the edge boss of the upper cover 102 .

[0028] The protruding dimension of the edge of the upper cover 102 is slightly narrower than the sealing groove 108 .

[0029] The inner cavity of the sealed dev...

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Abstract

The invention belongs to the technical field of heat dissipation devices, in particular to a thermal-shock-resistant heat dissipation device based on a phase change material which can realize temperature control of high-power electronic devices such as inverters under complex conditions such as thermal shock and thermal coupling. The thermal-shock-resistant heat dissipation device includes a shell(101), an upper cover (102), screws (103), ribs (106) and heating equipment (108). The upper cover (102) is fixed above the shell (101) by the screws (103). The heating equipment (108) is arranged inthe shell (101), and a large number of ribs (106) are laid above the heating equipment (108). A ring of sealing groove (105) is arranged along the edge of the shell (101). Sealant (104) is thrown into the gap between the sealing groove (105) and the edge boss of the upper cover (102). The edge boss of the upper cover (102) is slightly narrower than the sealing groove (105). The inner cavity of the sealed device is filled with a phase change material which is a single-component alkane compound. The ribs (106) are provided with diversion grooves (107).

Description

technical field [0001] The invention belongs to the technical field of heat dissipation devices, and in particular relates to a thermal shock resistance heat dissipation device based on phase change materials. Background technique [0002] The research subject of this project belongs to the thermal control technology field of power electronic equipment, which is one of the key technologies in reliability design of high-power servo drive control technology. [0003] With the rapid development of the servo control system, the load capacity continues to rise, and various large-capacity power electronic devices are applied in the servo control system. As a key device of electric drive, the reliability of inverter plays an important role in servo control. With the development of high-power power electronic devices, the capacity of the inverter and the switching frequency of the device are rapidly increasing, and the loss of the device is also rising. Due to the development of s...

Claims

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Application Information

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IPC IPC(8): H05K5/06H05K7/20
Inventor 李超张华张巍高建华
Owner BEIJING RES INST OF PRECISE MECHATRONICS CONTROLS
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