Micro-etching solution capable of preventing circular hole from turning white

A technology of micro-etching solution and hole ring, which is applied in the field of printed circuit board production, can solve the problems of copper lattice change, white hole ring, etc., and achieve the effects of promoting corrosion, avoiding air, and high stability

Active Publication Date: 2019-05-10
上海富柏化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the process of hydrogen peroxide biting the circuit board, the copper atomic structure deviates from the idea

Method used

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  • Micro-etching solution capable of preventing circular hole from turning white
  • Micro-etching solution capable of preventing circular hole from turning white
  • Micro-etching solution capable of preventing circular hole from turning white

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A microetching solution that can prevent the whitening of the hole circle, wherein the mass concentration of each component of the microetching solution is as follows:

[0035]

[0036] Wherein the copper biting inhibitor is citric acid;

[0037] The copper-biting accelerator is cycloethylamine;

[0038] The hydrogen peroxide stabilizer is methanesulfonic acid;

[0039] The low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.

[0040] A kind of microetching solution that can prevent hole ring from turning white, its proportioning process comprises the following steps:

[0041] (1) Add 500 deionized water in the micro-etching tank;

[0042] (2) Add the copper-biting accelerator into the micro-etching tank in step (1) and stir for 7 minutes;

[0043] (3) adding mass concentration to the microetching tank in step (2) is 50% sulfuric acid;

[0044] (4) Add the copper-biting inhibitor into the micro-etching tank in step (3) and stir for 8 minutes;...

Embodiment 2

[0048] A microetching solution that can prevent the whitening of the hole ring, wherein the mass concentration of each component of the microetching solution is as follows:

[0049]

[0050] Wherein the copper biting inhibitor is methanesulfonic acid;

[0051] The copper-biting accelerator is n-butanol;

[0052] The hydrogen peroxide stabilizer is phenolsulfonic acid;

[0053] The low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.

[0054] A kind of microetching solution that can prevent hole ring from turning white, its proportioning process comprises the following steps:

[0055] (1) Add 600ml of deionized water into the micro-etching tank;

[0056] (2) Add the copper-biting accelerator into the micro-etching tank in step (1) and stir for 6 minutes;

[0057] (3) adding mass concentration to the microetching tank in step (2) is 50% sulfuric acid;

[0058] (4) Add the copper-biting inhibitor into the micro-etching tank in step (3) and stir for 7 m...

Embodiment 3

[0062] A kind of microetching solution that can prevent hole ring from turning white, comprising the following parts by weight:

[0063]Wherein the mass concentration of each component of the microetching solution is as follows:

[0064]

[0065]

[0066] Wherein the copper biting inhibitor is tartaric acid;

[0067] The copper-biting accelerator is n-octylamine;

[0068] The hydrogen peroxide stabilizer is p-toluenesulfonic acid;

[0069] The low foaming surfactant is isooctyl alcohol.

[0070] A kind of microetching solution that can prevent hole ring from turning white, its proportioning process comprises the following steps:

[0071] (1) Add 700ml of deionized water into the micro-etching tank;

[0072] (2) Add the copper-biting accelerator into the micro-etching tank in step (1) and stir for 5 minutes;

[0073] (3) adding mass concentration to the microetching tank in step (2) is 50% sulfuric acid;

[0074] (4) Add the copper-biting inhibitor into the micro-et...

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PUM

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Abstract

The invention discloses a micro-etching solution capable of preventing a circular hole from turning white, and relates to the field of production of circuit boards. By adoption of the micro-etching solution, the problems that in the prior art, after a pore ring is electroplated, copper lattices are changed, and the circular hole turns white before pre-treatment micro-etching is conducted are solved. The micro-etching solution is technically characterized in that the micro-etching solution comprises 10-20g/L of hydrogen peroxide, 90-110g/L of sulfuric acid, 5-15g/L of a copper binding inhibitor, 0.5-2g/L of a copper binding accelerator, 1.5-3g/L of a hydrogen peroxide stabilizer, 0.2-0.3g/L of a low-foaming surfactant, and 1L of deionized water. According to the micro-etching solution capable of preventing the circular hole from turning white, relevant functional additives are added, so that a stable micro-etching rate is achieved, and the micro-etching process is mild and controllable;hydrogen peroxide decomposition is restrained, a copper surface can be uniformly coarsened; oxidization of the copper surface is unlikely to be caused, and changes of the copper lattices and whitening of the circular hole are effectively restrained; and residues on the plate surface can be removed easily, and pollution is small.

Description

technical field [0001] The invention relates to the field of printed circuit board production, more specifically, it relates to a microetching liquid which can prevent hole rings from turning white. Background technique [0002] In the production of PCB, it is necessary to use microetching solution to bite the copper layer of the circuit board. In the process of microetching, the circuit board is usually processed by microetching solution. The existing microetching solution includes composite potassium salt system and Sodium persulfate plus sulfuric acid system, etc., but ordinary micro-etching solutions often have problems such as rough and white pore rings and color differences during the etching process. [0003] The existing application publication number is the Chinese patent CN105734571A, which clearly discloses a metal surface microetching solution, which is composed of the following raw materials in mass percentage: 15-25% of dilute sulfuric acid with a mass fraction...

Claims

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Application Information

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IPC IPC(8): C23F1/18
Inventor 饶猛夏金良莫庆生
Owner 上海富柏化工有限公司
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