Polishing device special for up-drawing of oxygen-free copper rod

Abstract

The invention discloses a polishing device special for up-drawing of an oxygen-free copper rod, and belongs to the technical field of auxiliary polishing for varnished wire production. According to the technical key points, the polishing device comprises a bracket, a copper powder recovery box is arranged on the bracket in the vertical direction, a plurality of sets polishing units are arranged inthe copper powder recovery box at intervals in the height direction, and the to-be-polished copper rod passes through all the polishing units in the vertical direction; each polishing unit is composed of three or more grinding wheel polishing mechanisms which are evenly distributed at intervals in the circumferential direction of the to-be-polished copper rod and arranged in a staggered mode in the axial direction of the to-be-polished copper rod, and the grinding wheel polishing mechanisms comprise grinding wheels; the grinding wheels are arranged in the vertical direction, and the polishingend faces of the grinding wheels are each in an arc shape; and the total length of arc lines formed by contact between all the grinding wheels located on the same polishing unit and the to-be-polished copper rod is larger than the perimeter of the to-be-polished copper rod. The polishing device special for up-drawing of the oxygen-free copper rod is reasonable in structure, good in polishing effect and convenient to use, and is used for polishing of the oxygen-free copper rod.

Description

technical field [0001] The invention relates to a grinding device, more specifically, to a special grinding device for upward-leading oxygen-free copper rods. Background technique [0002] Oxygen-free copper rods produced by the up-draw method used in enameled wires will have obvious indentations after passing the traction wheel. The copper rods are gradually drawn into thinner wires through the wire drawing die and drums, but the existing indentations still remain. On the wire rod, the surface of the wire is not smooth or more copper powder remains, which causes the surface quality of the enameled wire and affects the adhesion of the paint film. During the wire drawing process of the oxygen-free copper rod produced by the upward drawing method, the shape of the copper rod is roughly round. Therefore, it is difficult to ensure the smooth appearance of the wire through the wire drawing die and the drum. For subsequent processing, it cannot effectively ensure the integrity of ...

AI Technical Summary

Problems solved by technology

[0002] Oxygen-free copper rods produced by the up-draw method used in enameled wires will have obvious indentations after passing the traction wheel. The copper rods are gradually drawn into thinner wires through the wire drawing die and drums, but the existing indentations still remain. On the wire material, the surface of the wire is not smooth or more copper powder is left, which causes the surface quality of the enameled wire and affects the adhesion of the paint film.

During the wire drawing process of the oxygen-free copper rod produced by the upward drawing method, the shape of the copper rod is roughly round. Therefore, it is difficult to ensure the smooth appearance of the wire through the wire drawing die and the drum. For subsequent processing, it cannot effectively ensure the integrity of the enameled wire. Processing quality

[0003] In order to make the surface of the material smooth and uniform, the oxygen-free copper rod produced by the upward drawing method is generally cleaned. The existing cleaning methods include mechanical cleaning and chemical treatment. Mechanical cleaning is to use mechanical equipment to polish and polish the article. However, for For the production of enameled wire, the existing mechanical polishing equipment cannot be directly applied to the polishing of copper rods, because the copper rods cannot be rotated like other items during polishing

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