Electroplating clamp and circuit board electroplating method using electroplating clamp

Abstract

The invention relates to the field of printed circuit board electroplating and discloses an electroplating clamp and a circuit board electroplating method using the electroplating clamp. The clamp comprises a clamp handle, connecting fixing parts, an electric conducting support and electric conducting clamping points. The electric conducting support comprises at least two opposite electric conducting edge strips distributed in a row in the vertical direction. The two opposite electric conducting edge strips are located at the same horizontal height. The connecting fixing parts of the electricconducting edge strips in the vertical direction fix the electric conducting edge strips and are fixedly connected with the clamp handle above. Each electric conducting edge strip is at least providedwith one electric conducting clamping point. The portions, except for the portion making contact with the electric conducting clamping points, of the electric conducting edge strips are wrapped withinsulating jackets correspondingly. By the adoption of the clamp, testing circuit chips are clamped oppositely, the back faces of the testing circuit chips are opposite, the front faces of the testingcircuit chips face the outer side of the clamp, then electroplating is carried out, and the relative growth coefficient of a plating layer is calculated. According to the relative growth coefficientof the plating layer, the normalized electroplating total area and the normalized electroplating total current are calculated, and then electroplating of products is carried out formally.

Description

technical field [0001] The invention relates to the field of printed circuit board electroplating, in particular to an electroplating fixture and a circuit board electroplating method using the electroplating fixture. Background technique [0002] The electroplated gold layer is very suitable for microwave transmission because of its good corrosion resistance, solderability, low surface contact resistance, and high infrared radiation coefficient and reflection coefficient. It is one of the widely used methods for surface plating of microwave printed circuit boards. one. Gold electroplating for microwave printed circuits is usually carried out directly on the surface copper layer without a nickel barrier layer in between. This is because nickel is ferromagnetic at room temperature, which can adversely affect microwave transmission and is generally not used in microwave and millimeter wave circuits. Both gold and copper belong to the face-centered cubic lattice structure sys...

AI Technical Summary

Problems solved by technology

[0005] This method of operation has the following limitations in production: (1) The gold layer on the front has been electroplated twice, and there are intermittent and pauses in the middle, and it is used for cleaning, drying, filming, etc. (2) For circuit boards with metallized via holes, due to the existence of the insulating protective film on the back during the second electroplating, the via holes become blind hole structures, and the solution exchange is difficult, so the holes are plated with gold. (3) The temperature of the electroplating gold solution is as high as 60°C, and long-term electroplating will cause the insulating film to dissolve and pollute the plating solution, and the service life of the plating solution will be reduced; (4) The highly toxic potassium aurous cyanide solution system is generally used in the gold plating solution, and the residual plating solution in the hole and the waste insulating film treatment process further increase the safety hazards of the electroplating process

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