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Equal-path grinding and polishing integrated device

A path and polishing cloth technology, applied in grinding/polishing equipment, grinding machines, abrasive belt grinders, etc., can solve the problem of unstable surface quality of hand-held grinding and polishing metallographic samples, and achieve controllable grinding and polishing speed and easy maintenance. , the effect of controllable pressing force

Pending Publication Date: 2019-06-04
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an equal-path grinding and polishing integrated device, which solves the problem of unstable surface quality of hand-held grinding and polishing metallographic samples, and improves work efficiency

Method used

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  • Equal-path grinding and polishing integrated device
  • Equal-path grinding and polishing integrated device
  • Equal-path grinding and polishing integrated device

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Embodiment Construction

[0050] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] The method of using an equal-path grinding and polishing integrated device of the present invention is:

[0052] First, the sandpaper 8 is installed on the sandpaper delivery reel 4 and the sandpaper recovery reel 23, the tensioning device 20 is adjusted to make the sandpaper 8 tighten on the mirror platform 18, the workpiece slider 11 is pushed to the initial position of the grinding longitudinal direction, and the longitudinal wire The bar support 30 ...

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Abstract

The invention discloses an equal-path grinding and polishing integrated device. The equal-path grinding and polishing integrated device comprises an abrasive paper control mechanism, a polishing clothcontrol mechanism, a test piece clamping motion mechanism and a device body, wherein the abrasive paper control mechanism is used for grinding a test piece and has the functions of automatically replacing abrasive paper and collecting waste abrasive paper; the polishing cloth control mechanism is used for polishing the test piece and has the functions of automatically replacing polishing cloth and collecting waste polishing cloth; and the test piece clamping motion mechanism has the functions of constant-pressure clamping of the test piece, test piece path motion and path planning. Two processes of grinding and polishing can be completed under one-time clamping, and thus the work efficiency is improved; and by controlling linear motion of the test piece, it is ensured that the test piecegrinding distances are equal and the paths are the same, the problem of edge subsiding of the disc rotary type grinding test piece is avoided, and the grinding quality is improved.

Description

technical field [0001] The invention relates to the field of grinding and polishing, in particular to an integrated equal-path grinding and polishing device. Background technique [0002] In the study of the mechanical properties of materials, the metallographic structure observation and analysis of materials will be carried out. In the process of preparing metallographic samples, grinding and polishing processes are required. Whether a metallographic sample with a smooth surface is obtained directly determines the accuracy of material analysis. Therefore, under the premise of ensuring the grinding and polishing quality of metallographic samples, it is particularly important to complete the grinding and polishing process quickly and with high quality. [0003] The existing grinding and polishing method is to hold the sample by hand and apply a certain pressing force to grind or polish on sandpaper or polishing cloth. Generally, it is first ground on a fixed-speed turntable...

Claims

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Application Information

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IPC IPC(8): B24B21/00B24B21/04B24B41/06B24B41/02B24B49/00G01N1/32G01N1/28
CPCY02P70/10
Inventor 时启航付秀丽潘永智周彬
Owner UNIV OF JINAN
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