Laser etching method of MEMS silicon structure
A laser etching method and silicon structure technology, applied in the field of micromachining, can solve the problems of poor etching morphology, large heat-affected area, particle pollution, etc., and achieve the effects of reducing dissipation, high radiation intensity, and reducing repetition frequency
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[0032] A method for laser etching of a MEMS silicon structure according to the present invention will be described in detail below in conjunction with specific embodiments.
[0033] Such as figure 1 Shown, the laser etching method of a kind of MEMS silicon structure of the present invention comprises the following steps:
[0034] Step 1, the laser beam 11 partially irradiates the surface of the silicon material 13 through the objective lens 12, and the silicon material 13 is heated after absorbing part of the energy;
[0035] Step 2, the surface of the irradiated area is melted into a melting zone 14, part of the silicon material 13 is vaporized into smoke and molten spatter 15, and part of it is scattered on the processing surface of the silicon material 13 to form solid spatter 16;
[0036] Step 3: After the laser irradiation is completed, the silicon material 13 is condensed, showing heat-affected zones 17 and cracks 18 .
[0037] The laser beam 11 is generated by an ultr...
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