Method for preparing biomimetic-structure latex-conductive polymer composite material and latex-conductive polymer composite film and application of latex-conductive polymer composite film
A conductive polymer and composite material technology, applied in the field of non-contact sensors, can solve the problems of non-extensibility, complicated process, and high manufacturing cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0062] With 1mg poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid as conductive material, concentration is the water dispersion of 0.03% by weight, 250mg of carboxylated styrene-butadiene latex water dispersion with solid content rate of 64% by weight. Stir to mix to form a light white dispersion. Stir vigorously for 25 minutes at a temperature of 20-25°C. Wherein, by calculation, based on the total weight of the light white dispersion, the amount of poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid is 0.03% by weight; the amount of carboxylated styrene-butadiene latex is 4.92% by weight %; and the amount of water is 95.04% by weight.
[0063] The obtained off-white dispersion was poured into a common flat-bottomed rubber mold measuring 3 cm x 4 cm x 1 mm. A light black polymer film 1 can be obtained by drying for 10 hours in an oven at a temperature of 35-40° C. using a low-temperature slow evaporation method.
Embodiment 2
[0065] Experiment with a method similar to Example 1, except that the carboxylated styrene-butadiene latex is changed to natural latex to obtain a light black polymer film 2.
Embodiment 3
[0067]Experiment with a method similar to that of Example 1, except that carboxylated styrene-butadiene latex was changed to silicon acrylic latex to obtain light black polymer film 3 .
PUM
| Property | Measurement | Unit |
|---|---|---|
| Breaking strength | aaaaa | aaaaa |
| Young's modulus | aaaaa | aaaaa |
| Young's modulus | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


