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Method for reducing error of embedded resistor

A resistance and error technology, applied in the field of circuit board processing and manufacturing, can solve problems such as large resistance error, and achieve the effects of small relative error, good uniformity and good compatibility

Active Publication Date: 2019-06-07
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problems that the existing embedded resistors used in printed circuit boards have large resistance value errors and the stability of embedded resistors between different batches is poor in terms of their functional values, the invention provides a method to reduce the embedded resistors. The method of resistance resistance error

Method used

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  • Method for reducing error of embedded resistor
  • Method for reducing error of embedded resistor

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Embodiment

[0028] This embodiment provides a method for reducing the resistance error of the embedded resistor, which specifically includes the following steps:

[0029] Step 1: Make the conductive traces of the PCB:

[0030] Use the epoxy resin double-sided copper-clad laminate with a dielectric layer thickness of 100 μm and a copper thickness of 12 μm produced by Shengyi Company as the inner layer plate, and paste a photoresist layer on the surface of the conductor layer 2 of the double-sided copper-clad laminate, using wet film coating or Dry film is pressed, then exposed and developed to realize the transfer of conductive patterns. Specifically, film exposure method or laser direct imaging method can be used, and then acidic etching potion or alkaline etching potion is used to remove the excess conductor layer 2, and peel off the covering on the target. The photoresist layer of the conductive circuit to complete the production of the conductive circuit;

[0031] Step 2: Design of Em...

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Abstract

The invention discloses a method for reducing an error of an embedded resistor, and belongs to the technical field of circuit board processing and manufacturing. A resistance layer deposition region and a resistance monitoring device access region are simultaneously formed on an inner-layer circuit of a printed circuit board, the resistance of a resistance layer is monitored through the resistancemonitoring device to reach a standard resistance value during deposition of the resistance layer to fabricate the resistor. By the method, the problems that the resistance value stability is poor during an existing embedded resistor fabrication process and the resistance value of the embedded resistor does not conform to the design requirement due to process sensitivity can be solved. By employing the method, the square resistance of the embedded resistors at different batches is basically maintained consistent, is favorable in uniformity and is small in relative error with the standard resistance value, and an error standard of a primary device is conformed; and meanwhile, the method has good compatibility with a fabrication method of the existing embedded resistor, the embedment of thelarge-resistance resistor can be achieved, circuit design is facilitated, and large-scale promotion and application in the industry of the printed circuit board can be achieved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing and manufacturing, and in particular relates to a method for reducing the resistance value error of an embedded resistor. Background technique [0002] The miniaturization, integration and multifunctionalization of electronic products are the most important driving force for the development of the electronic industry. PCB (Printed Circuit Board, printed circuit board) is the most important assembly platform for electronic products. While electronic products are developing in the direction of miniaturization, multi-function, high reliability, integration, and portability, printed circuit boards are also facing challenges. Unprecedented challenges. For a long time, various components and subsystems are assembled on the surface of the printed circuit board, which inevitably leads to the complexity of the circuit layout and system of the printed circuit board. Since most of the comp...

Claims

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Application Information

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IPC IPC(8): H01C17/235H01C17/22H01C17/075H01C17/065
Inventor 周国云苟雪萍张秀梅何为王守绪陈苑明洪延王翀杨文君
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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