Compound thermal-conductive interface material and cooling structure in optical module plugging occasion

Abstract

The invention provides a compound thermal-conductive interface material suitable for a plugging occasion between an optical module and a shell cooler. The compound thermal-conductive interface material suitable for the plugging occasion between the optical module and the shell cooler comprises a thermal-conductive layer, an adhesive layer and a wear-resistant layer which are sequentially arranged;a material of the thermal-conductive layer is a thermal-conductive interface material which has a thermal conductivity coefficient higher than 2 W / m.K in a thickness direction and thickness in a range of 70-500 mum, a material of the wear-resistant layer is a wear-resistant material which has a thermal conductivity coefficient higher than 0.3 W / m.K and thickness smaller than 50 mum, and the compound thermal-conductive interface material is fixed to an optical module plugging structure through the adhesive layer. The compound thermal-conductive interface material is composed of the thermal-conductive layer, the adhesive layer and the wear-resistant layer, wherein the wear-resistant layer provides scratch-resistant performance, and meanwhile, high thermal conductivity of the thermal-conductive layer under protection of the wear-resistant layer is used for improving the interface thermal resistance; therefore, the compound thermal-conductive interface material is suitable for the gap-filling cooling occasion, which is used for filling a gap between the optical module and the shell cooler, with plugging requirements.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a composite heat-conducting interface material and a heat dissipation structure in the scene of plugging and unplugging an optical module. Background technique [0002] With the upgrading of communication networks, the optical communication industry requires higher and higher data transmission volumes, and with the popularization of laser chip-level applications, the specifications of optical modules are developing towards 10 Gigabit and above, and at the same time, the size of equipment is developing towards miniaturization. High integration leads to high heat generation, which brings the challenge of overheating in the equipment operating environment. In the traditional solution, the heat sink of the device directly contacts the photoelectric conversion module, and the heat generated from the chip needs to pass through the optical module shell and the gap between the hea...

AI Technical Summary

Problems solved by technology

The above-mentioned first material can meet the requirements of low thermal resistance and low thickness, but it cannot meet the wear resistance. In the plugging and unplugging scene, the TIM material will overflow, leak or chip with the action of plugging and unplugging, which will affect the use, cleaning and maintenance of the equipment. adverse effect on operation

Although the second type of wear-resistant and thermally conductive material can meet the requirements of friction resistance, it cannot meet the requirements of high thermal conductivity and ultra-thin applications. It can be solved by other methods such as surface flatness, and improving the surface flatness not only puts forward high requirements on the accuracy of the equipment of the manufacturer, but also increases the cost, and often only improves part of the contact, which cannot fully meet the needs of equipment upgrades. Come the requirement of high thermal conductivity

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