Compound thermal-conductive interface material and cooling structure in optical module plugging occasion

A technology of interface material and heat conduction material, which is applied in the field of communication, can solve the problems of incompatibility in performance, inability to fully meet the high heat conduction efficiency of equipment, and increased cost.

Inactive Publication Date: 2019-06-11
JONES TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned first material can meet the requirements of low thermal resistance and low thickness, but it cannot meet the wear resistance. In the plugging and unplugging scene, the TIM material will overflow, leak or chip with the action of plugging and unplugging, which will affect the use, cleaning and maintenance of the equipment. adverse effect on operation
Although the second type of wear-resistant and thermally conductive material can meet the requirements of...

Method used

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  • Compound thermal-conductive interface material and cooling structure in optical module plugging occasion
  • Compound thermal-conductive interface material and cooling structure in optical module plugging occasion
  • Compound thermal-conductive interface material and cooling structure in optical module plugging occasion

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Embodiment 1

[0038] For scenarios that require insulation, choose a PI film with a thickness of 50 μm and thermal conductivity (thermal conductivity 0.78W / m K) as the wear-resistant layer, a thickness of 400 μm, a thermal conductivity of 2.3 W / m K, and self-adhesive The thermally conductive phase change material (PCM) is used as the thermally conductive layer, and the pressure-sensitive double-sided adhesive with a thickness of 5 μm is used as the adhesive layer, and the surrounding local adhesive is used, and the width is 5mm; The boss ends are arranged in sequence, thereby obtaining an ultra-thin plug-resistant composite thermal interface material.

[0039] The thermal simulation test platform is used to evaluate the improvement effect of this scheme on the heat dissipation of the device, and compare the PCM with a thickness of 400 μm without a wear-resistant layer structure, and the same structure but with a 200 μm PET film and a 400 μm thermal conductivity with a thermal conductivity of...

Embodiment 2

[0044] For the application scenarios without insulation requirements, choose aluminum foil with a thickness of 25 μm as the wear-resistant layer, PCM material with a thickness of 200 μm and a thermal conductivity of 2W / m K as the heat conduction layer, and a pressure-sensitive double-sided adhesive with a thickness of 10 μm as the adhesive layer , using local adhesive around the sides, with a width of 3mm; the above-mentioned thermally conductive layer, adhesive layer and wear-resistant layer are arranged sequentially from the boss end of the bottom surface of the radiator, thereby obtaining a composite thermally conductive interface material. Evaluate the improvement effect of this solution on the heat dissipation of the device through the thermal simulation test platform; select 9W as the input power, simulate the above application scenario, compare the temperature difference between the radiator and the heating device, and insert and unplug 200 times (plug force 30 ~ 40N) Th...

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Abstract

The invention provides a compound thermal-conductive interface material suitable for a plugging occasion between an optical module and a shell cooler. The compound thermal-conductive interface material suitable for the plugging occasion between the optical module and the shell cooler comprises a thermal-conductive layer, an adhesive layer and a wear-resistant layer which are sequentially arranged;a material of the thermal-conductive layer is a thermal-conductive interface material which has a thermal conductivity coefficient higher than 2 W/m.K in a thickness direction and thickness in a range of 70-500 mum, a material of the wear-resistant layer is a wear-resistant material which has a thermal conductivity coefficient higher than 0.3 W/m.K and thickness smaller than 50 mum, and the compound thermal-conductive interface material is fixed to an optical module plugging structure through the adhesive layer. The compound thermal-conductive interface material is composed of the thermal-conductive layer, the adhesive layer and the wear-resistant layer, wherein the wear-resistant layer provides scratch-resistant performance, and meanwhile, high thermal conductivity of the thermal-conductive layer under protection of the wear-resistant layer is used for improving the interface thermal resistance; therefore, the compound thermal-conductive interface material is suitable for the gap-filling cooling occasion, which is used for filling a gap between the optical module and the shell cooler, with plugging requirements.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a composite heat-conducting interface material and a heat dissipation structure in the scene of plugging and unplugging an optical module. Background technique [0002] With the upgrading of communication networks, the optical communication industry requires higher and higher data transmission volumes, and with the popularization of laser chip-level applications, the specifications of optical modules are developing towards 10 Gigabit and above, and at the same time, the size of equipment is developing towards miniaturization. High integration leads to high heat generation, which brings the challenge of overheating in the equipment operating environment. In the traditional solution, the heat sink of the device directly contacts the photoelectric conversion module, and the heat generated from the chip needs to pass through the optical module shell and the gap between the hea...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B27/36B32B27/34B32B27/06B32B15/20B32B15/04B32B7/12B32B33/00H01L23/367H01L23/373
Inventor 吴晓宁
Owner JONES TECH
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