Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of heat-conducting silicone adhesive and its cured product and led element

A technology of silicone adhesives and cured products, which is applied in the direction of non-polymer adhesive additives, semiconductor/solid-state device components, adhesives, etc., and can solve the problems of increasing the difficulty of dispensing process implementation and the deterioration of LED chip bonding strength, etc. question

Active Publication Date: 2021-06-22
BEIJING KMT TECH
View PDF19 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding strength of the thermally conductive silicone adhesive to LED chips (especially those containing silver-plated leads) is still difficult to meet the harsh requirements of the actual use environment, and when it is used at high temperatures for a long time, its cured product will not affect the LED chips. Chip bonding strength tends to deteriorate
[0006] In addition, in order to obtain significantly improved thermal conductivity, it is usually necessary to add a large amount of thermally conductive fillers to the thermally conductive silicone adhesive, which will significantly increase the viscosity of the thermally conductive silicone adhesive, thereby increasing the time required for adhesive processing and LED component manufacturing. The difficulty of implementing the dispensing process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of heat-conducting silicone adhesive and its cured product and led element
  • A kind of heat-conducting silicone adhesive and its cured product and led element
  • A kind of heat-conducting silicone adhesive and its cured product and led element

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0135] In a reactor equipped with a stirrer, thermometer and condensing reflux element, 44.4 g of vinyltrimethoxysilane, 165.2 g of 3-(2,3-glycidoxy)propyltrimethoxy Silane, 54 grams of deionized water and 93.7 grams of toluene were stirred evenly, and then 1.8 grams of concentrated sulfuric acid was added. Keep the inner temperature of the reactor at 70-80° C. for 5 hours. After the reaction, the reaction product was transferred to a separatory funnel and left to stand for 2 hours, and the acid layer was separated to obtain an organic phase. Add 4 g of anhydrous sodium sulfate and 2 g of sodium bicarbonate to the organic phase for neutralization and filter.

[0136] Transfer the filtered organic phase to a vacuum distillation device to keep the inner temperature at 100-120° C. for vacuum distillation, and obtain the distillation product after the solvent (toluene) is basically drained. Transfer the distilled product to a blast oven to keep the internal temperature at 150° C...

Synthetic example 2

[0141] In a reactor equipped with a stirrer, thermometer and condensing reflux element, 103.6 g of vinyltrimethoxysilane, 70.8 g of 3-(2,3-glycidoxy)propyltrimethoxy Silane, 54 grams of deionized water and 70.3 grams of toluene were stirred evenly, and then 1.5 grams of concentrated sulfuric acid was added, and the inner temperature of the reactor was kept at 70-80° C. for 5 hours. After the reaction, the reaction product was transferred to a separatory funnel and left to stand for 2 hours, and the acid layer was separated to obtain an organic phase. Add 3.6 g of anhydrous sodium sulfate and 1.8 g of sodium bicarbonate to the organic phase for neutralization and filter.

[0142] Transfer the filtered organic phase to a vacuum distillation device to keep the inner temperature at 100-120° C. for vacuum distillation, and obtain the distillation product after the solvent (toluene) is basically drained. Transfer the distilled product to a blast oven to keep the internal temperatur...

Embodiment 1-6 and comparative example 1-3

[0147] According to the formulation shown in Table 1, linear organopolysiloxane, platinum catalyst, reaction inhibitor, linear organohydrogenpolysiloxane, organopolysilsesquioxane (if used After mixing the components) with the thermally conductive filler, the mixture was added to a three-roll mill and kneaded for 30 minutes to obtain a thermally conductive silicone adhesive.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a thermally conductive silicone adhesive, comprising: (A) a linear organopolysiloxane having at least two alkenyl groups bonded to silicon atoms; (B) having at least two alkenyl groups bonded to silicon atoms Straight-chain organohydrogenpolysiloxane with combined hydrogen atoms; (C) such as formula (1): (R 1 SiO 3 / 2 ) a (R 2 SiO 3 / 2 ) b The organopolysilsesquioxane shown in formula (1), R 1 selected from alkenyl, R 2 Selected from monovalent organic groups containing epoxy groups, 0.1≤a≤0.9, 0.1≤b≤0.9, and a+b=1; (D) thermally conductive filler; (E) platinum catalyst; and (F) reaction Inhibitor. Through the cooperation between the various components, the adhesive is endowed with good adhesion performance and processing performance.

Description

technical field [0001] The invention relates to the field of thermally conductive adhesives, in particular to a thermally conductive silicone adhesive, its cured product and an LED element. Background technique [0002] Light-emitting diodes (LEDs) have exploded in popularity in recent years because they consume less power and last longer than incandescent and fluorescent bulbs. When manufacturing LED components, it is usually necessary to use adhesives (also known as die-bonding glue) to bond and fix the LED chip on the substrate, and considering that the luminous efficiency of LEDs decreases at high temperatures, it is usually also used in the adhesive Add thermal conductive filler to facilitate heat dissipation of LED components. [0003] At present, thermally conductive adhesives used for the above purposes mainly use epoxy resin and silicone resin as the base. Among them, silicone resin has better heat resistance and anti-aging performance, and can avoid the yellowing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06H01L23/29
Inventor 王海亮李振忠
Owner BEIJING KMT TECH