Wafer edge chamfering machining method of quartz crystal resonator

Abstract

The invention discloses a wafer edge chamfering machining method of a quartz crystal resonator. A to-be-machined edge portion of a quartz wafer is divided into a plurality of machining areas; the quartz wafer is placed on a special clamp, and laser with enough strength is used for irradiating the quartz wafer; and edge chamfering machining of thickness decreasing and contour shape changing of thewafer is achieved. The machining method has the beneficial effects that thickness decreasing and contour changing can be achieved in an assigned edge area of the quartz wafer; meanwhile, edge chamfering machining can also be flexibly completed; the method is simple in technological process, efficient, clean and free of pollution, convenient to modify and high in individuation; and the laser processing precision can be flexibly controlled, and therefore by adjusting machining parameters, the target of fast and accurate machining of the thickness and the morphology is achieved.

Description

technical field [0001] The invention relates to a processing method for a quartz crystal resonator, in particular to a chamfering processing method for changing the edge thickness and contour shape of a wafer of the quartz crystal resonator. Background technique [0002] As a key component of frequency control, quartz crystal resonators are widely used in various electronic devices. Using the inverse piezoelectric effect of the quartz crystal material can realize high-frequency mechanical vibration, and then provide a stable frequency source for signal selection and information detection and other functions. The working state of the resonator is the coupled vibration of multiple modes of the quartz crystal plate. If the frequency of other modes (parasitic modes) is close to the main working mode (usually thickness shear mode), it will lead to increased resistance and quality The factor is reduced, and even frequency jump occurs in severe cases, so that the resonator cannot ...

AI Technical Summary

Problems solved by technology

[0004] The existing chamfering methods are generally based on the completion of processing in the drum by mechanical sanding. The main disadvantages are: long time-consuming, complicated process, serious pollution, poor processing accuracy, poor controllability, poor repeatability, and Conducive to small-batch processing and personalized customization; for the rapidly growing demand for small devices, it is urgent to adopt new technologies to improve and innovate the beveling process

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